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13. 
Cover image for Grundprinzipien der Mechatronik Modellbildung und Simulation mit Bondgraphen
Grundprinzipien der Mechatronik Modellbildung und Simulation mit Bondgraphen
Author 
Roddeck, Werner. author. SpringerLink (Online service)
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ONLINE(338334.1)
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http://dx.doi.org/10.1007/978-3-8348-2194-2
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14. 
Cover image for Simulation elektronischer Schaltungen mit MICRO-CAP Eine Einführung für Studierende und Ingenieure/-innen in der Praxis
Simulation elektronischer Schaltungen mit MICRO-CAP Eine Einführung für Studierende und Ingenieure/-innen in der Praxis
Author 
Vester, Joachim. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-8348-9333-8
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15. 
Cover image for Simulation von Röhrenverstärkern mit SPICE PC-Simulationen von Elektronenröhren in Audioverstärkern
Simulation von Röhrenverstärkern mit SPICE PC-Simulationen von Elektronenröhren in Audioverstärkern
Author 
Potchinkov, Alexander. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-8348-9613-1
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16. 
Cover image for Simulation of Semiconductor Processes and Devices 2007 SISPAD 2007
Simulation of Semiconductor Processes and Devices 2007 SISPAD 2007
Author 
Grasser, Tibor. editor. Selberherr, Siegfried. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-211-72861-1
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17. 
Cover image for Fast Simulation of Electro-Thermal MEMS Efficient Dynamic Compact Models
Fast Simulation of Electro-Thermal MEMS Efficient Dynamic Compact Models
Author 
Bechtold, Tamara. author. Rudnyi, Evgenii B. author. Korvink, Jan G. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-34613-5
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18. 
Cover image for Electronics Process Technology Production Modelling, Simulation and Optimisation
Electronics Process Technology Production Modelling, Simulation and Optimisation
Author 
Sauer, Wilfried. author. Oppermann, Martin. author. Werner, Sebastian. author. Wohlrabe, Heinz. author. Zerna, Thomas. author.
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http://dx.doi.org/10.1007/1-84628-354-X
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19. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-3627-0
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20. 
Cover image for Mechatronic Systems Analysis, Design and Implementation
Mechatronic Systems Analysis, Design and Implementation
Author 
Boukas, El-Kébir. author. AL-Sunni, Fouad M. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-22324-2
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21. 
Cover image for Precision Assembly Technologies and Systems 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings
Precision Assembly Technologies and Systems 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings
Author 
Ratchev, Svetan. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-28163-1
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22. 
Cover image for Precision Assembly Technologies and Systems 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings
Precision Assembly Technologies and Systems 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings
Author 
Ratchev, Svetan. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-11598-1
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23. 
Cover image for Languages for Embedded Systems and their Applications Selected Contributions on Specification, Design, and Verification from FDL’08
Languages for Embedded Systems and their Applications Selected Contributions on Specification, Design, and Verification from FDL’08
Author 
Radetzki, Martin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9714-0
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24. 
Cover image for Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Author 
Kogel, Tim. author. Leupers, Rainer. author. Meyr, Heinrich. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-4826-2
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