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13. 
Cover image for Femtosecond Laser Micromachining Photonic and Microfluidic Devices in Transparent Materials
Femtosecond Laser Micromachining Photonic and Microfluidic Devices in Transparent Materials
Author 
Osellame, Roberto. editor. Cerullo, Giulio. editor. Ramponi, Roberta. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-23366-1
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14. 
Cover image for Magnetoelectric Response in Low-Dimensional Frustrated Spin Systems
Magnetoelectric Response in Low-Dimensional Frustrated Spin Systems
Author 
Seki, Shinichiro. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-4-431-54091-5
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15. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-0463-7
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16. 
Cover image for Electronic Properties of Materials
Electronic Properties of Materials
Author 
Hummel, Rolf E. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-8164-6
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17. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-88783-8
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18. 
Cover image for Fiberglass and Glass Technology Energy-Friendly Compositions and Applications
Fiberglass and Glass Technology Energy-Friendly Compositions and Applications
Author 
Wallenberger, Frederick T. editor. Bingham, Paul A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0736-3
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19. 
Cover image for Advanced Materials Science & Technology in China: A Roadmap to 2050
Advanced Materials Science & Technology in China: A Roadmap to 2050
Author 
Lu, Ke. editor. Chen, Lidong. editor. He, Tianbai. editor. Yan, Qing. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-05318-4
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20. 
Cover image for Metamaterials and Plasmonics: Fundamentals, Modelling, Applications
Metamaterials and Plasmonics: Fundamentals, Modelling, Applications
Author 
Zouhdi, Saïd. editor. Sihvola, Ari. editor. Vinogradov, Alexey P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9407-1
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21. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-78219-5
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22. 
Cover image for Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Author 
Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-79394-8
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23. 
Cover image for Nanoscale Magnetic Materials and Applications
Nanoscale Magnetic Materials and Applications
Author 
Liu, J. Ping. editor. Fullerton, Eric. editor. Gutfleisch, Oliver. editor. Sellmyer, D.J. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-85600-1
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24. 
Cover image for Oxide and Nitride Semiconductors Processing, Properties, and Applications
Oxide and Nitride Semiconductors Processing, Properties, and Applications
Author 
Yao, Takafumi. editor. Hong, Soon-Ku. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-88847-5
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