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2015
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13. 
Cover image for Designing TSVs for 3D Integrated Circuits
Designing TSVs for 3D Integrated Circuits
Author 
Khan, Nauman. author. Hassoun, Soha. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331791.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5508-0
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14. 
Cover image for 3D Video Coding for Embedded Devices Energy Efficient Algorithms and Architectures
3D Video Coding for Embedded Devices Energy Efficient Algorithms and Architectures
Author 
Zatt, Bruno. author. Shafique, Muhammad. author. Bampi, Sergio. author. Henkel, Jörg. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332110.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-6759-5
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15. 
Cover image for Model-Based Design of Adaptive Embedded Systems
Model-Based Design of Adaptive Embedded Systems
Author 
Basten, Twan. editor. Hamberg, Roelof. editor. Reckers, Frans. editor. Verriet, Jacques. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331594.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-4821-1
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16. 
Cover image for Embedded Systems for Smart Appliances and Energy Management
Embedded Systems for Smart Appliances and Energy Management
Author 
Grimm, Christoph. editor. Neumann, Peter. editor. Mahlknecht, Stefan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330846.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-8795-2
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17. 
Cover image for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Author 
Lim, Sung Kyu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330852.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9542-1
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18. 
Cover image for Dynamic Reconfiguration in Real-Time Systems Energy, Performance, and Thermal Perspectives
Dynamic Reconfiguration in Real-Time Systems Energy, Performance, and Thermal Perspectives
Author 
Wang, Weixun. author. Mishra, Prabhat. author. Ranka, Sanjay. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331237.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0278-7
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19. 
Cover image for UTLEON3: Exploring Fine-Grain Multi-Threading in FPGAs
UTLEON3: Exploring Fine-Grain Multi-Threading in FPGAs
Author 
Daněk, Martin. author. Kafka, Leoš. author. Kohout, Lukáš. author. Sýkora, Jaroslav. author. Bartosinski, Roman. author.
Preferred Shelf Number 
ONLINE(331311.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-2410-9
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20. 
Cover image for Constraining Designs for Synthesis and Timing Analysis A Practical Guide to Synopsys Design Constraints (SDC)
Constraining Designs for Synthesis and Timing Analysis A Practical Guide to Synopsys Design Constraints (SDC)
Author 
Gangadharan, Sridhar. author. Churiwala, Sanjay. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331327.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3269-2
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21. 
Cover image for Facing the Multicore-Challenge III Aspects of New Paradigms and Technologies in Parallel Computing
Facing the Multicore-Challenge III Aspects of New Paradigms and Technologies in Parallel Computing
Author 
Keller, Rainer. editor. Kramer, David. editor. Weiss, Jan-Philipp. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(334079.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-35893-7
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22. 
Cover image for Modeling, Analysis and Optimization of Network-on-Chip Communication Architectures
Modeling, Analysis and Optimization of Network-on-Chip Communication Architectures
Author 
Ogras, Umit Y. author. Marculescu, Radu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(335726.1)
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-3958-1
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