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1. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
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2. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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3. 
Cover image for Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Author 
Suhir, Ephraim. Lee, Y. C. Wong, C. P.
Preferred Shelf Number 
TK7874 .M438 2007 V.1
Format: 
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4. 
Cover image for Contamination of electronic assemblies
Contamination of electronic assemblies
Author 
Pecht, Michael.
Preferred Shelf Number 
TK7870.15 C66 2003
Format: 
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5. 
Cover image for Recent Trends in VLSI and Semiconductor Packaging
Recent Trends in VLSI and Semiconductor Packaging
Author 
Vasudeva Reddy, T., editor. Madhava Rao, K., editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003616399
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
Cover image for Functional polyimide dielectrics : structure, properties, and applications
Functional polyimide dielectrics : structure, properties, and applications
Author 
Zha, Jun-Wei, editor.
Preferred Shelf Number 
TK7872 .D53 F86 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527849031
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7. 
Cover image for Advances in Printing, Packaging and Communication Technologies
Advances in Printing, Packaging and Communication Technologies
Author 
Song, Huihui. editor. Xu, Min. editor. Yang, Li. editor. Zhang, Linghao. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4467-4
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8. 
Cover image for PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.
PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.
Author 
JAMNIA, ALI.
Preferred Shelf Number 
TK7870.15
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003564485
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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9. 
Cover image for Technological Advances and Trends in Cheese Making
Technological Advances and Trends in Cheese Making
Author 
Mansha Rafiq, Syed. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-94476-5
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10. 
Cover image for Innovative Technologies for Printing, Packaging and Digital Media
Innovative Technologies for Printing, Packaging and Digital Media
Author 
Song, Huihui. editor. Xu, Min. editor. Yang, Li. editor. Zhang, Linghao. editor. Yan, Shu. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-9955-2
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11. 
Cover image for Sensing technologies for real time monitoring of water quality
Sensing technologies for real time monitoring of water quality
Author 
Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.
Preferred Shelf Number 
TD367 .M3175 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843
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12. 
Cover image for Planar microwave sensors
Planar microwave sensors
Author 
Martín, Ferran, 1965- author. Vélez, Paris, author. Muñoz-Enano, Jonathan, author. Su, Lijuan, author.
Preferred Shelf Number 
TK7876 .M22 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119811060
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