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1. 
Cover image for The Computer Engineering Handbook.
The Computer Engineering Handbook.
Author 
Oklobdzija, Vojin G., author. CRC Press LLC.
Preferred Shelf Number 
TK7885 .C645 2002
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781420041545
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Cover image for Electrochemical microsystem technologies
Electrochemical microsystem technologies
Author 
Datta, Madhav. Osaka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)
Preferred Shelf Number 
TP255 .E38 2002
Electronic Access 
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3. 
Cover image for Electrochemistry of nanomaterials
Electrochemistry of nanomaterials
Author 
Hodes, Gary. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527612789
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4. 
Cover image for Microsystem technology
Microsystem technology
Author 
Menz, W. (Wolfgang) Mohr, J. (Jürgen) Paul, Oliver. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527613007
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5. 
Cover image for Computational intelligence in manufacturing handbook
Computational intelligence in manufacturing handbook
Author 
Wang, Jun (Jun Li Jim) Kusiak, Andrew.
Preferred Shelf Number 
TS155.6 .W36 2001
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6. 
Cover image for Advances in Thermotropic Liquid Crystal Polymers : Thin-Film Polymerization, Characterization, Blends and Applications.
Advances in Thermotropic Liquid Crystal Polymers : Thin-Film Polymerization, Characterization, Blends and Applications.
Author 
Chung, Tai-shung, author. CRC Press.
Preferred Shelf Number 
TP1180 .P666 T48 2001
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780367800864
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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7. 
Cover image for Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries
Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries
Author 
Chung, Deborah D. L., author.
Preferred Shelf Number 
TA403 .C47 2001
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8. 
Cover image for Micromechanics and MEMS classic and seminal papers to 1990
Micromechanics and MEMS classic and seminal papers to 1990
Author 
Trimmer, W. Institute of Electrical and Electronics Engineers.
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ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5273520
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9. 
Cover image for Chemical mechanical planarization of microelectronic materials
Chemical mechanical planarization of microelectronic materials
Author 
Steigerwald, Joseph M. Murarka, S. P. Gutmann, Ronald J. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527617746
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley041/96006198.html
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10. 
Cover image for Routing in the third dimension from VLSI chips to MCMs
Routing in the third dimension from VLSI chips to MCMs
Author 
Sherwani, N. A. (Naveed A.) Bhingarde, Siddharth. Panyam, Anand.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263943
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11. 
Cover image for Electron-beam technology in microelectronic fabrication
Electron-beam technology in microelectronic fabrication
Author 
Brewer, George Raymond, 1922- Ballantyne, J. P.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780121335502
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12. 
Cover image for Advances in microwaves. Volume 5
Advances in microwaves. Volume 5
Author 
Young, Leo, 1926-2006.
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ONLINE
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ScienceDirect http://www.sciencedirect.com/science/book/9780120279050
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