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73. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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74. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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75. 
Cover image for Reliability Engineering Theory and Practice
Reliability Engineering Theory and Practice
Author 
Birolini, Alessandro. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-49390-7
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76. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
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Tu, King-Ning. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-38892-2
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77. 
Cover image for Integrated Circuit Test Engineering Modern Techniques
Integrated Circuit Test Engineering Modern Techniques
Author 
Grout, Ian A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-84628-173-3
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78. 
Cover image for Electronics Process Technology Production Modelling, Simulation and Optimisation
Electronics Process Technology Production Modelling, Simulation and Optimisation
Author 
Sauer, Wilfried. author. Oppermann, Martin. author. Werner, Sebastian. author. Wohlrabe, Heinz. author. Zerna, Thomas. author.
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http://dx.doi.org/10.1007/1-84628-354-X
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79. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138345
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