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109. 
Cover image for Three-Dimensional Design Methodologies for Tree-based FPGA Architecture
Three-Dimensional Design Methodologies for Tree-based FPGA Architecture
Author 
Pangracious, Vinod. author. Marrakchi, Zied. author. Mehrez, Habib. author. SpringerLink (Online service)
Preferred Shelf Number 
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Electronic Access 
https://doi.org/10.1007/978-3-319-19174-4
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110. 
Cover image for New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
Author 
Elleithy, Khaled. editor. Sobh, Tarek. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06764-3
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111. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9266-5
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112. 
Cover image for Wearable Electronics Sensors For Safe and Healthy Living
Wearable Electronics Sensors For Safe and Healthy Living
Author 
Mukhopadhyay, Subhas C. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-18191-2
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113. 
Cover image for Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Author 
Sobh, Tarek. editor. Elleithy, Khaled. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06773-5
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114. 
Cover image for Soft Actuators Materials, Modeling, Applications, and Future Perspectives
Soft Actuators Materials, Modeling, Applications, and Future Perspectives
Author 
Asaka, Kinji. editor. Okuzaki, Hidenori. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-54767-9
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