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121. 
Cover image for Nanonetworks : the future of communication and computation
Nanonetworks : the future of communication and computation
Author 
Lau, Florian-Lennert A., author.
Preferred Shelf Number 
TK7874.845 .L38 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394213139
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122. 
Cover image for Polymer surface modification to enhance adhesion : techniques and applications
Polymer surface modification to enhance adhesion : techniques and applications
Author 
Netravali, Anil Narayan, 1948- editor. Mittal, K. L., 1945- editor.
Preferred Shelf Number 
QD381.9 .S97 P65 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394231034
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123. 
Cover image for Emerging Computing: From Devices to Systems Looking Beyond Moore and Von Neumann
Emerging Computing: From Devices to Systems Looking Beyond Moore and Von Neumann
Author 
Aly, Mohamed M. Sabry. editor. Chattopadhyay, Anupam. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-16-7487-7
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124. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
Author 
Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0451-8
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125. 
Cover image for Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Author 
Siano, Pierluigi. editor. Williamson, Sheldon. editor. Beevi, Sabeena. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0915-5
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126. 
Cover image for Switched Inductor Power IC Design
Switched Inductor Power IC Design
Author 
Rincón-Mora, Gabriel Alfonso. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-030-95899-2
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127. 
Cover image for Distributed Economic Operation in Smart Grid: Model-Based and Model-Free Perspectives
Distributed Economic Operation in Smart Grid: Model-Based and Model-Free Perspectives
Author 
Qin, Jiahu. author. Wan, Yanni. author. Li, Fangyuan. author. Kang, Yu. author. Fu, Weiming. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-8594-2
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128. 
Cover image for Essentials of C Programming with Microsoft® Visual Studio®
Essentials of C Programming with Microsoft® Visual Studio®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-35711-4
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129. 
Cover image for Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Author 
Philippe, Bart. author. Reynaert, Patrick. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-11224-9
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130. 
Cover image for High-Speed System and Analog Input/Output Design
High-Speed System and Analog Input/Output Design
Author 
Tran, Thanh T. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-04954-5
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131. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-658-41041-4
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132. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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