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145. 
Cover image for Nanomaterials Mechanics and Mechanisms
Nanomaterials Mechanics and Mechanisms
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Ramesh, K.T. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-09783-1
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146. 
Cover image for Sapphire Material, Manufacturing, Applications
Sapphire Material, Manufacturing, Applications
Author 
Pishchik, Valerian. author. Lytvynov, Leonid A. author. Dobrovinskaya, Elena R. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-85695-7
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147. 
Cover image for IUTAM Symposium on Mechanical Properties of Cellular Materials Proceedings of the IUTAM Symposium on Mechanical Properties of Cellular Materials, held September 17–20, 2007, LMT-Cachan, Cachan, France
IUTAM Symposium on Mechanical Properties of Cellular Materials Proceedings of the IUTAM Symposium on Mechanical Properties of Cellular Materials, held September 17–20, 2007, LMT-Cachan, Cachan, France
Author 
Zhao, Han. editor. Fleck, N. A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9404-0
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148. 
Cover image for Theoretical Surface Science A Microscopic Perspective
Theoretical Surface Science A Microscopic Perspective
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Groß, Axel. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-68969-0
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149. 
Cover image for Angle and Spin Resolved Auger Emission Theory and Applications to Atoms and Molecules
Angle and Spin Resolved Auger Emission Theory and Applications to Atoms and Molecules
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Lohmann, Bernd. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-74630-0
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150. 
Cover image for Kleben Grundlagen, Technologien, Anwendungen
Kleben Grundlagen, Technologien, Anwendungen
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Habenicht, Gerd. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-85266-7
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151. 
Cover image for Shape Memory Alloys Modeling and Engineering Applications
Shape Memory Alloys Modeling and Engineering Applications
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Lagoudas, Dimitris C. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-47685-8
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152. 
Cover image for Atomistic Modeling of Materials Failure
Atomistic Modeling of Materials Failure
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Buehler, Markus J. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76426-9
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153. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
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Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76534-1
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154. 
Cover image for Self-Consistent Methods for Composites Vol.1: Static Problems
Self-Consistent Methods for Composites Vol.1: Static Problems
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Kanaun, S. K. author. Levin, V. M. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6664-1
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155. 
Cover image for Self-Consistent Methods for Composites Vol. 2: Wave Propagation in Heterogeneous Materials
Self-Consistent Methods for Composites Vol. 2: Wave Propagation in Heterogeneous Materials
Author 
Kanaun, S. K. author. Levin, V. M. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6968-0
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156. 
Cover image for Narrow Gap Semiconductors 2007 Proceedings of the 13th International Conference, 8–12 July, 2007, Guildford, UK
Narrow Gap Semiconductors 2007 Proceedings of the 13th International Conference, 8–12 July, 2007, Guildford, UK
Author 
Murdin, Ben. editor. Clowes, Steve. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-8425-6
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