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13. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2308-1
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14. 
Cover image for Signals and Systems A Practical Approach
Signals and Systems A Practical Approach
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Sundararajan, D. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-19377-4
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15. 
Cover image for High-Speed System and Analog Input/Output Design
High-Speed System and Analog Input/Output Design
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Tran, Thanh T. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-04954-5
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16. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
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Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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17. 
Cover image for Designing Mobile Robot Interfaces with 16-bit Microchip Microcontrollers
Designing Mobile Robot Interfaces with 16-bit Microchip Microcontrollers
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Bindal, Ahmet. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-27841-9
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18. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
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Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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19. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0357-3
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20. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
Author 
Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0408-2
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21. 
Cover image for Engineering Design A Survival Guide to Senior Capstone
Engineering Design A Survival Guide to Senior Capstone
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Mettler, Cory J. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-23309-8
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22. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
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Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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23. 
Cover image for Efficient Execution of Irregular Dataflow Graphs Hardware/Software Co-optimization for Probabilistic AI and Sparse Linear Algebra
Efficient Execution of Irregular Dataflow Graphs Hardware/Software Co-optimization for Probabilistic AI and Sparse Linear Algebra
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Shah, Nimish. author. Meert, Wannes. author. Verhelst, Marian. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-33136-7
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24. 
Cover image for Advances in Signal Processing, Embedded Systems and IoT Proceedings of Seventh ICMEET- 2022
Advances in Signal Processing, Embedded Systems and IoT Proceedings of Seventh ICMEET- 2022
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Chakravarthy, V.V.S.S.S. editor. Bhateja, Vikrant. editor. Flores Fuentes, Wendy. editor. Anguera, Jaume. editor. Vasavi, K. Padma. editor.
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