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Microelectronic packaging.
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13. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
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14. 
Cover image for Chemical mechanical planarization of microelectronic materials
Chemical mechanical planarization of microelectronic materials
Author 
Steigerwald, Joseph M. Murarka, S. P. Gutmann, Ronald J. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527617746
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley041/96006198.html
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15. 
Cover image for Electron-beam technology in microelectronic fabrication
Electron-beam technology in microelectronic fabrication
Author 
Brewer, George Raymond, 1922- Ballantyne, J. P.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780121335502
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16. 
Cover image for Plasma electronics : applications in microelectronic device fabrication
Plasma electronics : applications in microelectronic device fabrication
Author 
Makabe, T. (Toshiaki), author. Petrovi¿̐ưc, Z., author.
Preferred Shelf Number 
ONLINE(356943.1)
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17. 
Cover image for Plasma electronics applications in microelectronic device fabrication
Plasma electronics applications in microelectronic device fabrication
Author 
Makabe, T. (Toshiaki) Petrovi?, Z.
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ONLINE
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18. 
Cover image for Modeling of film deposition for microelectronic applications
Modeling of film deposition for microelectronic applications
Author 
Rossnagel, Stephen M.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780125330220
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19. 
Cover image for Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Author 
Liu, S. (Sheng), 1963- Liu, Yong, 1962- Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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20. 
Cover image for Handbook of lead-free solder technology for microelectronic assemblies
Handbook of lead-free solder technology for microelectronic assemblies
Author 
Puttlitz, Karl J. Stalter, Kathleen A.
Preferred Shelf Number 
ONLINE
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21. 
Cover image for Polymeric materials for microelectronic applications : science and technology
Polymeric materials for microelectronic applications : science and technology
Author 
Ito, Hiroshi, ed. Tagawa, Seichi, ed. Horie, Kazuyuki, 1941- Kåobunshi Gakkai (Japan). Polymers for Microelectronics and Photonics Group. American Chemical Society. Division of Polymeric Materials: Science and Engineering.
Preferred Shelf Number 
TK 7871.15.P6 P59 1994
Format: 
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22. 
Cover image for Microelectronic processing : an introduction to the manufacture of integrated circuits
Microelectronic processing : an introduction to the manufacture of integrated circuits
Author 
Ruska, W. Scot.
Preferred Shelf Number 
TK 7874 R87 1987
Format: 
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23. 
Cover image for Heat transfer in microelectronic equipment : a practical guide
Heat transfer in microelectronic equipment : a practical guide
Author 
Seely, John H.
Preferred Shelf Number 
TK 7874 S4 1972
Format: 
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24. 
Cover image for Enhanced phase-locked loop structures for power and energy applications
Enhanced phase-locked loop structures for power and energy applications
Author 
Karimi-Ghartemani, Masoud, author.
Preferred Shelf Number 
ONLINE(341794.1)
Electronic Access 
Ebook Library http://public.eblib.com/choice/publicfullrecord.aspx?p=1658815
ebrary http://site.ebrary.com/id/10853333
John Wiley http://dx.doi.org/10.1002/9781118795187
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