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1. 
Cover image for Thermal Transport in Oblique Finned Micro/Minichannels
Thermal Transport in Oblique Finned Micro/Minichannels
Author 
Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09647-6
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2. 
Cover image for Atomic Layer Deposition for Semiconductors
Atomic Layer Deposition for Semiconductors
Author 
Hwang, Cheol Seong. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-8054-9
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3. 
Cover image for Electronics and Circuit Analysis Using MATLAB, Second Edition
Electronics and Circuit Analysis Using MATLAB, Second Edition
Author 
Attia, John Okyere, author.
Preferred Shelf Number 
TK7835 .A885 2004
Electronic Access 
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