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1. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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2. 
Cover image for Power Management of Digital Circuits in Deep Sub-Micron CMOS Technologies
Power Management of Digital Circuits in Deep Sub-Micron CMOS Technologies
Author 
Henzler, Stephan. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-5081-X
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3. 
Cover image for Introduction to Avionics Systems
Introduction to Avionics Systems
Author 
Collinson, R.P.G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-29215-6
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4. 
Cover image for Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Author 
Siano, Pierluigi. editor. Williamson, Sheldon. editor. Beevi, Sabeena. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0915-5
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5. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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6. 
Cover image for Gain-Cell Embedded DRAMs for Low-Power VLSI Systems-on-Chip
Gain-Cell Embedded DRAMs for Low-Power VLSI Systems-on-Chip
Author 
Meinerzhagen, Pascal. author. Teman, Adam. author. Giterman, Robert. author. Edri, Noa. author. Burg, Andreas. author.
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https://doi.org/10.1007/978-3-319-60402-2
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7. 
Cover image for Digital Storage in Consumer Electronics The Essential Guide
Digital Storage in Consumer Electronics The Essential Guide
Author 
Coughlin, Thomas M. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-69907-3
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8. 
Cover image for The Malaysia-Japan Model on Technology Partnership International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference
The Malaysia-Japan Model on Technology Partnership International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference
Author 
Ab. Hamid, Khairuddin. editor. Ono, Osamu. editor. Bostamam, Anas Muhamad. editor. Poh Ai Ling, Amy. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-54439-5
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9. 
Cover image for FPGA Design Best Practices for Team-based Reuse
FPGA Design Best Practices for Team-based Reuse
Author 
Simpson, Philip Andrew. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17924-7
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10. 
Cover image for Trusted Computing for Embedded Systems
Trusted Computing for Embedded Systems
Author 
Candaele, Bernard. editor. Soudris, Dimitrios. editor. Anagnostopoulos, Iraklis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09420-5
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11. 
Cover image for Theory and Applications of Applied Electromagnetics APPEIC 2014
Theory and Applications of Applied Electromagnetics APPEIC 2014
Author 
Sulaiman, Hamzah Asyrani. editor. Othman, Mohd Azlishah. editor. Abd. Aziz, Mohamad Zoinol Abidin. editor. Abd Malek, Mohd Fareq. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17269-9
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12. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09111-2
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