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Author

SpringerLink (Online service)

(6)

Brown, William D., 1943-

(2)

Greenhouse, Hal.

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

Agarwal, Rakish, author.

(1)

Avtgis, Alexander W.

(1)

Barlow, Fred D.

(1)

Blackwell, Glenn R.

(1)

Carney, Charles (Charles F.)

(1)

(1)

Cressler, John D.

(1)

Del Castillo, Enrique.

(1)

Dishongh, Terrance J., author.

(1)

Dorf, Richard C.

(1)

Elshabini, Aicha.

(1)

Gerlach, Gerald. editor.

(1)

(1)

Hurwitz, Arnon Max.

(1)

Jamnia, Ali, 1961- author.

(1)

Javadpour, Sirus, author.

(1)

Lee, Ning-Cheng.

(1)

(1)

Lee, Y. C. editor.

(1)

Li, Yi (Grace). editor.

(1)

Licari, James J., 1930-

(1)

Liu, S. (Sheng), 1963-

(1)

Liu, Yong. author.

(1)

Lowry, Robert (Robert K.), 1944-

(1)

Luo, Xiaobing, 1974-

(1)

Mahajan, Rahul, author.

(1)

Mantooth, H. Alan, 1963-

(1)

McCluskey, F. Patrick, author.

(1)

Megow, William F.

(1)

Monkhouse, Donald C.

(1)

Moon, Kyoung-Sik. editor.

(1)

(1)

Osten, Wolfgang.

(1)

Pecht, Michael, author.

(1)

Pecht, Michael.

(1)

Pengelly, Raymond S.

(1)

Puttlitz, Karl J.

(1)

Remsburg, Ralph., author.

(1)

Romenesko, Bruce.

(1)

Stalter, Kathleen A.

(1)

Suganuma, Katsuaki.

(1)

Suhir, E. editor.

(1)

Suhir, Ephraim.

(1)

Swanson, Dale W.

(1)

Süli, Frank, author.

(1)

Tai-Ran Hsu, ed.

(1)

Tong, Xingcun Colin. author.

(1)

Villanucci, Robert S., 1944-

(1)

Voyiadjis, George Z. editor.

(1)

Walker, C. A. (Colin A.)

(1)

Whitaker, Jerry C.

(1)

Wolter, Klaus-Jürgen. editor.

(1)

(1)

Wong, C. P. editor.

(1)

Wong, C.P. editor.

(1)

Language

(32)

Publication Date

-

(4)

(4)

(4)

(3)

(3)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Subject

Electronic packaging.

(15)

(4)

Electronic apparatus and appliances -- Design and construction.

(3)

Electronic books.

(3)

(3)

Microelectronic packaging.

(3)

Microelectronics.

(3)

Nanotechnology.

(3)

Optical materials.

(3)

Solder and soldering.

(3)

Chip scale packaging.

(2)

Electronics -- Materials -- Permeability.

(2)

Sealing (Technology)

(2)

Surfaces (Physics).

(2)

(1)

(1)

Aerospace engineering.

(1)

Amplifiers (Electronics).

(1)

Biomedical engineering.

(1)

(1)

Building materials.

(1)

Ceramic materials.

(1)

(1)

(1)

Classical Mechanics.

(1)

Contamination (Technology)

(1)

(1)

Dichtung (Technik)

(1)

Drugs -- Testing.

(1)

Electric connectors.

(1)

Electric lighting -- Equipment and supplies.

(1)

Electromagnetics & Microwaves

(1)

Electronic Packaging

(1)

Electronic apparatus and appliances -- Reliability.

(1)

Electronic apparatus and appliances -- Thermal properties.

(1)

Electronic ceramics.

(1)

Electronic circuits -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Defects -- Prevention.

(1)

Electronic packaging -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Materials.

(1)

Electronics -- Materials.

(1)

Elektronik aygıtlar ve aletler -- Tasarım ve yapım.

(1)

Elektronik paketleme -- Kusurlar -- Korunma.

(1)

Elektronik paketleme.

(1)

Elektronisches Bauelement.

(1)

Engineering -- Handbooks, manuals, etc.

(1)

Engineering Mechanics.

(1)

Engineering design.

(1)

Environmental protection.

(1)

Environmental testing.

(1)

Extreme environments.

(1)

Fabrika sağlıklaştırımı.

(1)

Factory sanitation.

(1)

Field-effect transistors.

(1)

Gallium arsenide.

(1)

Green products.

(1)

Heat -- Transmission.

(1)

Interconnects (Integrated circuit technology) -- Design and construction.

(1)

Kontaminasyon (Teknoloji)

(1)

Light emitting diodes -- Computer simulation.

(1)

Light emitting diodes -- Design and construction.

(1)

Mechanics, Applied.

(1)

(1)

Microelectromechanical systems.

(1)

Microfabrication.

(1)

Micromechanics.

(1)

Microwave transistors.

(1)

Mikroelektronik.

(1)

Mise sous boîtier (Microélectronique)

(1)

Mise sous boîtier (Électronique)

(1)

Mixing circuits.

(1)

Moire method -- Case studies.

(1)

(1)

Nanostructured materials.

(1)

Optical detectors -- Industrial applications.

(1)

Optoelectronic devices.

(1)

Optoelectronics.

(1)

Optoelektronik.

(1)

Oscillators, Electric.

(1)

Particles (Nuclear physics).

(1)

Passive components.

(1)

(1)

Production management.

(1)

Production of electric energy or power.

(1)

Quality control -- Optical methods.

(1)

Sealing (Technology).

(1)

Semiconductor industry -- Production control.

(1)

Semiconductors -- Design and construction.

(1)

Semiconductors.

(1)

Solid Mechanics.

(1)

(1)

Structural Materials.

(1)

(1)

Systems engineering.

(1)

Telecommunication.

(1)

Material Type

Shelf Location

Beytepe General Collection

Electronic Library

Library

Beytepe Library

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13.

Cover image for Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Author

Voyiadjis, George Z. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-1-4614-5589-9

Format:

Availability

Online Library~1

Available:
Copies:

14.

Cover image for Extreme environment electronics

Extreme environment electronics

Extreme environment electronics

Author

Cressler, John D. Mantooth, H. Alan, 1963-

Preferred Shelf Number

TK7870.24 .E97 2013

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

Available:
Copies:

15.

Cover image for Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity of electronic packages

Author

Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9781437778779

Format:

Availability

Online Library~1

Available:
Copies:

16.

Cover image for LED packaging for lighting applications design, manufacturing, and testing

LED packaging for lighting applications design, manufacturing, and testing

LED packaging for lighting applications design, manufacturing, and testing

Author

Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-

Preferred Shelf Number

ONLINE

Electronic Access

Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643

Format:

Availability

Online Library~1

Available:
Copies:

17.

Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Author

Gilleo, Ken.

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

Format:

Availability

Online Library~1

Available:
Copies:

18.

Cover image for Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Author

Jamnia, Ali, 1961- author.

Preferred Shelf Number

TK7870.15 .J36 2009

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

Available:
Copies:

19.

Cover image for Optical inspection of microsystems

Optical inspection of microsystems

Optical inspection of microsystems

Author

Osten, Wolfgang.

Preferred Shelf Number

TS156.2 .O652 2007

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

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20.

Cover image for Ceramic interconnect technology handbook

Ceramic interconnect technology handbook

Ceramic interconnect technology handbook

Author

Barlow, Fred D. Elshabini, Aicha.

Preferred Shelf Number

TK7871.15 .C4 C44 2007

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

Available:
Copies:

21.

Cover image for Drug products for clinical trials

Drug products for clinical trials

Drug products for clinical trials

Author

Monkhouse, Donald C. Carney, Charles (Charles F.) Clark, Jim.

Preferred Shelf Number

RM301.27 .D796 2006

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

Available:
Copies:

22.

Cover image for Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Author

Licari, James J., 1930- Swanson, Dale W.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815515135

Format:

Availability

Online Library~1

Available:
Copies:

23.

Cover image for The engineering handbook

The engineering handbook

The engineering handbook

Author

Dorf, Richard C.

Preferred Shelf Number

TA151 .E424 2005

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

Available:
Copies:

24.

Cover image for The electronics handbook

The electronics handbook

The electronics handbook

Author

Whitaker, Jerry C.

Preferred Shelf Number

TK7867 .E4244 2005

Electronic Access

Click here to view.

Format:

Availability

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Available:
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1 2 3

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