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Microelectronic packaging.
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1. 
Cover image for Semiconductor packaging : materials interaction and reliability
Semiconductor packaging : materials interaction and reliability
Author 
Chen, Andrea., author. Lo, Randy.
Preferred Shelf Number 
TK7870.15 .C54 2012
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2. 
Cover image for Quantum-well laser array packaging nanoscale packaging techniques
Quantum-well laser array packaging nanoscale packaging techniques
Author 
Tomm, Jens W. Jim�enez, J. (Juan)
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ONLINE
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3. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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ONLINE
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4. 
Cover image for 3D IC stacking technology
3D IC stacking technology
Author 
Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.
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5. 
Cover image for Introduction to microsystem packaging technology
Introduction to microsystem packaging technology
Author 
Jin, Yufeng., author. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-
Preferred Shelf Number 
TK7870.15 .J56 2011
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6. 
Cover image for Nanotechnology for telecommunications
Nanotechnology for telecommunications
Author 
Anwar, Sohail.
Preferred Shelf Number 
TK5103 .N36 2010
Electronic Access 
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7. 
Cover image for Advanced electronic packaging
Advanced electronic packaging
Author 
Ulrich, Richard K. (Richard Kevin), 1955- Brown, William D., 1943-
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522
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8. 
Cover image for Advanced electronic packaging
Advanced electronic packaging
Author 
Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-
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9. 
Cover image for IC component sockets
IC component sockets
Author 
Liu, Weifeng. Pecht, Michael. John Wiley & Sons.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/0471648272
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html
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