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1. 
Cover image for Really good packaging explained top design professionals critique 300 package designs & explain what makes them work
Really good packaging explained top design professionals critique 300 package designs & explain what makes them work
Author 
Edwards, Bronwen.
Preferred Shelf Number 
ONLINE
Electronic Access 
EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=571401
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2. 
Cover image for Packaging research in food product design and development
Packaging research in food product design and development
Author 
Moskowitz, Howard R. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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3. 
Cover image for Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Author 
Jamnia, Ali, 1961- author.
Preferred Shelf Number 
TK7870.15 .J36 2009
Electronic Access 
Click here to view.
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4. 
Cover image for Package design workbook : the art and science of successful packaging
Package design workbook : the art and science of successful packaging
Author 
DuPuis, Steven. Silva, John.
Preferred Shelf Number 
NC1002.P33 D87 2008
Format: 
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5. 
Cover image for Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Author 
Suhir, Ephraim. Lee, Y. C. Wong, C. P.
Preferred Shelf Number 
TK7874 .M438 2007 V.1
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6. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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7. 
Cover image for Degradation, stabilization, and recycling of packaging materials
Degradation, stabilization, and recycling of packaging materials
Author 
Rabnawaz, Muhammad, author. Selke, Susan E. M., author. Wyman, Ian, author.
Preferred Shelf Number 
TS198.2 .R33 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394294299
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8. 
Cover image for Applied circular economy engineering : technologies and business solutions to implement circularity
Applied circular economy engineering : technologies and business solutions to implement circularity
Preferred Shelf Number 
HC79 .E5 A67 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527847358
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9. 
Cover image for Pharmaceutical polymer formulations and its applications
Pharmaceutical polymer formulations and its applications
Author 
Keservani, Raj K., 1981- editor. Ahire, Eknath D., editor. Kesharwani, Rajesh Kumar, 1978- editor.
Preferred Shelf Number 
RS201 .P65 P43 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394172856
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10. 
Cover image for Green innovations for industrial development and business sustainability : models and implementation strategies
Green innovations for industrial development and business sustainability : models and implementation strategies
Author 
Sharma, Ravindra (Professor of management), editor. Rana, Geeta, editor. Agarwal, Shivani, editor.
Preferred Shelf Number 
HC79 .T4
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003458944
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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11. 
Cover image for EMERGING SUSTAINABLE AND RENEWABLE COMPOSITES from packaging to electronics.
EMERGING SUSTAINABLE AND RENEWABLE COMPOSITES from packaging to electronics.
Author 
Atiqah, A.
Preferred Shelf Number 
TA418.9 .C6
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003408215
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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12. 
Cover image for Thermal management materials for electronic packaging : preparation, characterization, and devices
Thermal management materials for electronic packaging : preparation, characterization, and devices
Author 
Tian, Xingyou, editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843121
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