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13. 
Cover image for Embedded Systems Design for High-Speed Data Acquisition and Control
Embedded Systems Design for High-Speed Data Acquisition and Control
Author 
Di Paolo Emilio, Maurizio. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-06865-7
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14. 
Cover image for Trusted Computing for Embedded Systems
Trusted Computing for Embedded Systems
Author 
Candaele, Bernard. editor. Soudris, Dimitrios. editor. Anagnostopoulos, Iraklis. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09420-5
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15. 
Cover image for Wideband CMOS Receivers
Wideband CMOS Receivers
Author 
Fernandes, Miguel D. editor. Oliveira, Luis B. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-18920-8
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16. 
Cover image for Analysis and Design of Networks-on-Chip Under High Process Variation
Analysis and Design of Networks-on-Chip Under High Process Variation
Author 
Ezz-Eldin, Rabab. author. El-Moursy, Magdy Ali. author. Hamed, Hesham F. A. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-25766-2
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17. 
Cover image for Dynamic Memory Management for Embedded Systems
Dynamic Memory Management for Embedded Systems
Author 
Atienza Alonso, David. author. Mamagkakis, Stylianos. author. Poucet, Christophe. author. Peón-Quirós, Miguel. author. Bartzas, Alexandros. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-10572-7
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18. 
Cover image for Low Power Interconnect Design
Low Power Interconnect Design
Author 
Saini, Sandeep. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-1323-3
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19. 
Cover image for FPGA Design Best Practices for Team-based Reuse
FPGA Design Best Practices for Team-based Reuse
Author 
Simpson, Philip Andrew. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17924-7
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20. 
Cover image for Arbitrary Modeling of TSVs for 3D Integrated Circuits
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Author 
Salah, Khaled. author. Ismail, Yehea. author. El-Rouby, Alaa. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-07611-9
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21. 
Cover image for Partial Reconfiguration on FPGAs Architectures, Tools and Applications
Partial Reconfiguration on FPGAs Architectures, Tools and Applications
Author 
Koch, Dirk. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331261.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1225-0
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22. 
Cover image for System-Level Validation High-Level Modeling and Directed Test Generation Techniques
System-Level Validation High-Level Modeling and Directed Test Generation Techniques
Author 
Chen, Mingsong. author. Qin, Xiaoke. author. Koo, Heon-Mo. author. Mishra, Prabhat. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331265.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1359-2
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23. 
Cover image for Embedded Systems Design with FPGAs
Embedded Systems Design with FPGAs
Author 
Athanas, Peter. editor. Pnevmatikatos, Dionisios. editor. Sklavos, Nicolas. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331266.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1362-2
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24. 
Cover image for Designing TSVs for 3D Integrated Circuits
Designing TSVs for 3D Integrated Circuits
Author 
Khan, Nauman. author. Hassoun, Soha. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331791.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5508-0
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