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13. 
Cover image for Source-Synchronous Networks-On-Chip Circuit and Architectural Interconnect Modeling
Source-Synchronous Networks-On-Chip Circuit and Architectural Interconnect Modeling
Author 
Mandal, Ayan. author. Khatri, Sunil P. author. Mahapatra, Rabi. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-1-4614-9405-8
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14. 
Cover image for Soft Actuators Materials, Modeling, Applications, and Future Perspectives
Soft Actuators Materials, Modeling, Applications, and Future Perspectives
Author 
Asaka, Kinji. editor. Okuzaki, Hidenori. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-54767-9
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15. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J. W. author. SpringerLink (Online service)
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ONLINE(332682.1)
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http://dx.doi.org/10.1007/978-3-319-00122-7
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16. 
Cover image for Limits, Modeling and Design of High-Speed Permanent Magnet Machines
Limits, Modeling and Design of High-Speed Permanent Magnet Machines
Author 
Borisavljevic, Aleksandar. author. SpringerLink (Online service)
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ONLINE(333714.1)
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http://dx.doi.org/10.1007/978-3-642-33457-3
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17. 
Cover image for System-Level Validation High-Level Modeling and Directed Test Generation Techniques
System-Level Validation High-Level Modeling and Directed Test Generation Techniques
Author 
Chen, Mingsong. author. Qin, Xiaoke. author. Koo, Heon-Mo. author. Mishra, Prabhat. author. SpringerLink (Online service)
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ONLINE(331265.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1359-2
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18. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1053-9
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19. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J.W. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6348-2
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20. 
Cover image for Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Author 
Gevorgian, Spartak. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-507-9
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21. 
Cover image for High-Level Modeling and Synthesis of Analog Integrated Systems
High-Level Modeling and Synthesis of Analog Integrated Systems
Author 
Martens, Ewout S. J. author. Gielen, Georges G. E. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6802-7
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22. 
Cover image for Design and Modeling of Millimeter-Wave CMOS Circuits for Wireless Transceivers Era of Sub-100nm Technology
Design and Modeling of Millimeter-Wave CMOS Circuits for Wireless Transceivers Era of Sub-100nm Technology
Author 
Lai, Ivan Chee-Hong. author. Fujishima, Minoru. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6999-4
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23. 
Cover image for Sensors Advancements in Modeling, Design Issues, Fabrication and Practical Applications
Sensors Advancements in Modeling, Design Issues, Fabrication and Practical Applications
Author 
Mukhopadhyay, S.C. editor. Huang, R.Y.M. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-69033-7
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24. 
Cover image for Semiconductor Modeling For Simulating Signal, Power, and Electromagnetic Integrity
Semiconductor Modeling For Simulating Signal, Power, and Electromagnetic Integrity
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Leventhal, Roy G. author. Green, Lynne. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b104647
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