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1. 
Cover image for Proceedings of the 1st International Conference on Fluid, Thermal and Energy Systems ICFTES 2022
Proceedings of the 1st International Conference on Fluid, Thermal and Energy Systems ICFTES 2022
Author 
Das, Sudev. editor. (orcid)0000-0001-9774-4150 Mangadoddy, Narasimha. editor. (orcid)0000-0002-3123-2811 Hoffmann, Jaap. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-5990-7
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2. 
Cover image for Advances in Heat Transfer and Fluid Dynamics Select Proceedings of AHTFD 2022
Advances in Heat Transfer and Fluid Dynamics Select Proceedings of AHTFD 2022
Author 
Siddiqui, Mohammad Altamush. editor. Hasan, Nadeem. editor. Tariq, Andallib. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-7213-5
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3. 
Cover image for HVACR Principles and Applications
HVACR Principles and Applications
Author 
Nandagopal, Nuggenhalli S. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-45267-3
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4. 
Cover image for Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 6 Proceedings of the 2022 Annual Conference on Experimental and Applied Mechanics
Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 6 Proceedings of the 2022 Annual Conference on Experimental and Applied Mechanics
Author 
Tighe, Rachael C. editor. Considine, John. editor. Kramer, Sharlotte L.B. editor. Berfield, Tom. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-17475-9
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5. 
Cover image for Design of thermal energy systems
Design of thermal energy systems
Author 
Majumdar, Pradip, 1954- author.
Preferred Shelf Number 
TJ808 .M345 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781118956922
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6. 
Cover image for Computational Fluid Dynamics Incompressible Turbulent Flows
Computational Fluid Dynamics Incompressible Turbulent Flows
Author 
Kajishima, Takeo. author. Taira, Kunihiko. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45304-0
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7. 
Cover image for Dynamics of Nanoparticles in Stagnation Flames
Dynamics of Nanoparticles in Stagnation Flames
Author 
Zhang, Yiyang. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-53615-5
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8. 
Cover image for A Thermochemical Heat Storage System for Households Combined Investigations of Thermal Transfers Coupled to Chemical Reactions
A Thermochemical Heat Storage System for Households Combined Investigations of Thermal Transfers Coupled to Chemical Reactions
Author 
Fopah Lele, Armand. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-41228-3
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9. 
Cover image for Modeling Thermodynamic Distance, Curvature and Fluctuations A Geometric Approach
Modeling Thermodynamic Distance, Curvature and Fluctuations A Geometric Approach
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Badescu, Viorel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-33789-0
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10. 
Cover image for Analytical Heat and Fluid Flow in Microchannels and Microsystems
Analytical Heat and Fluid Flow in Microchannels and Microsystems
Author 
Cotta, Renato M. author. Knupp, Diego C. author. Naveira-Cotta, Carolina P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-23312-3
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11. 
Cover image for Thermal Sensors Principles and Applications for Semiconductor Industries
Thermal Sensors Principles and Applications for Semiconductor Industries
Author 
Jha, Chandra Mohan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2581-0
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12. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
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Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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