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13. 
Cover image for Solid state physics : structure and properties of materials
Solid state physics : structure and properties of materials
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Wahab, M. A.
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QD931 D43 2010
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14. 
Cover image for Oxide based materials new sources, novel phases, new applications
Oxide based materials new sources, novel phases, new applications
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Gamba, A. (Aldo) Colella, C. (Carmine) Coluccia, S. (Salvatore)
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ScienceDirect http://www.sciencedirect.com/science/book/9780444519757
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15. 
Cover image for Introduction to surface and superlattice excitations
Introduction to surface and superlattice excitations
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Cottam, Michael G. Tilley, David R.
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Distributed by publisher. Purchase or institutional license may be required for access.
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16. 
Cover image for Principles of plasma discharges and materials processing
Principles of plasma discharges and materials processing
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Lieberman, M. A. (Michael A.) Lichtenberg, Allan J.
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ONLINE
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Full text available from Wiley InterScience
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=227410
John Wiley http://dx.doi.org/10.1002/0471724254
http://www3.interscience.wiley.com/cgi-bin/bookhome/109880578
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0618/2004058503-b.html
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17. 
Cover image for Characterization & control of interfaces for high quality advanced materials proceedings of the International Conference on the Characterization and Control of Interfaces for High Quality Advanced Materials (ICCCI 2003), Kurashiki, Japan, 2003
Characterization & control of interfaces for high quality advanced materials proceedings of the International Conference on the Characterization and Control of Interfaces for High Quality Advanced Materials (ICCCI 2003), Kurashiki, Japan, 2003
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International Conference on the Characterization and Control of Interfaces for High Quality Advanced Materials (2003 : Kurashiki-shi, Japan) Ewsuk, Kevin.
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ONLINE
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HathiTrust Digital Library, Limited view (search only) http://catalog.hathitrust.org/api/volumes/oclc/58411124.html
Wiley InterScience http://dx.doi.org/10.1002/9781118406038
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18. 
Cover image for Second-Generation HTS Conductors
Second-Generation HTS Conductors
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Goyal, Amit. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b106635
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19. 
Cover image for Complex Inorganic Solids Structural, Stability, and Magnetic Properties of Alloys
Complex Inorganic Solids Structural, Stability, and Magnetic Properties of Alloys
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Turchi, Patrice E. A. editor. Gonis, Antonios. editor. Rajan, Krishna. editor. Meike, Annemarie. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b136491
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20. 
Cover image for Physical Principles of Electron Microscopy An Introduction to TEM, SEM, and AEM
Physical Principles of Electron Microscopy An Introduction to TEM, SEM, and AEM
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Egerton, Ray F. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b136495
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21. 
Cover image for Thin Films and Heterostructures for Oxide Electronics
Thin Films and Heterostructures for Oxide Electronics
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Ogale, Satischandra B. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b136780
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22. 
Cover image for IUTAM Symposium on Physicochemical and Electromechanical Interactions in Porous Media
IUTAM Symposium on Physicochemical and Electromechanical Interactions in Porous Media
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Gladwell, G. M. L. editor. Huyghe, J.M. editor. Raats, Peter A.C. editor. Cowin, Stephen C. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-3865-8
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23. 
Cover image for The Rational Spirit in Modern Continuum Mechanics Essays and Papers Dedicated to the Memory of Clifford Ambrose Truesdell III
The Rational Spirit in Modern Continuum Mechanics Essays and Papers Dedicated to the Memory of Clifford Ambrose Truesdell III
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Man, Chi-Sing. editor. Fosdick, Roger L. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-2308-1
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24. 
Cover image for Forces, Growth and Form in Soft Condensed Matter: At the Interface between Physics and Biology
Forces, Growth and Form in Soft Condensed Matter: At the Interface between Physics and Biology
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Skjeltorp, A. T. editor. Belushkin, A. V. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-2340-5
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