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13. 
Cover image for Signal Processing, Telecommunication and Embedded Systems: Automation and Sustainability Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 4
Signal Processing, Telecommunication and Embedded Systems: Automation and Sustainability Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 4
Author 
Bhateja, Vikrant. editor. Flores-Fuentes, Wendy. editor. (orcid)0000-0002-1477-7449 Bhattacharya, Anagha. editor. Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-7253-0
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14. 
Cover image for Cyber-Security for Smart Grid Control Vulnerability Assessment, Attack Detection, and Mitigation
Cyber-Security for Smart Grid Control Vulnerability Assessment, Attack Detection, and Mitigation
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Sreejith, Amulya. author. Shanti Swarup, K. author. (orcid)0000-0002-4883-7649 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-1302-8
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15. 
Cover image for Artificial Intelligence and Sustainable Computing Proceedings of ICSISCET 2023
Artificial Intelligence and Sustainable Computing Proceedings of ICSISCET 2023
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Pandit, Manjaree. editor. Gaur, M. K. editor. Kumar, Sandeep. editor. (orcid)0000-0003-4125-4165 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-0327-2
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16. 
Cover image for Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Use Cases and Emerging Challenges
Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Use Cases and Emerging Challenges
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Pasricha, Sudeep. editor. Shafique, Muhammad. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-40677-5
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17. 
Cover image for Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Software Optimizations and Hardware/Software Codesign
Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Software Optimizations and Hardware/Software Codesign
Author 
Pasricha, Sudeep. editor. Shafique, Muhammad. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-39932-9
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18. 
Cover image for High-Performance Integrated Charge Pumps Design and Novel Solutions
High-Performance Integrated Charge Pumps Design and Novel Solutions
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Ballo, Andrea. author. Grasso, Alfio Dario. author. Palumbo, Gaetano. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-43597-3
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19. 
Cover image for Security of FPGA-Accelerated Cloud Computing Environments
Security of FPGA-Accelerated Cloud Computing Environments
Author 
Szefer, Jakub. editor. (orcid)0000-0001-9721-3640 Tessier, Russell. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-45395-3
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20. 
Cover image for Dew Computing The Sustainable IoT Perspectives
Dew Computing The Sustainable IoT Perspectives
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De, Debashis. editor. Roy, Samarjit. editor. (orcid)0000-0002-7874-8348 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-4590-0
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21. 
Cover image for Cryptography and Embedded Systems Security
Cryptography and Embedded Systems Security
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Hou, Xiaolu. author. Breier, Jakub. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-62205-2
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22. 
Cover image for Embedded Systems Design using the MSP430FR2355 LaunchPad™
Embedded Systems Design using the MSP430FR2355 LaunchPad™
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LaMeres, Brock J. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20888-1
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23. 
Cover image for Artificial Intelligence and Hardware Accelerators
Artificial Intelligence and Hardware Accelerators
Author 
Mishra, Ashutosh. editor. Cha, Jaekwang. editor. Park, Hyunbin. editor. Kim, Shiho. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-22170-5
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24. 
Cover image for Mapping Innovation The Discipline of Building Opportunity across Value Chains
Mapping Innovation The Discipline of Building Opportunity across Value Chains
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Anis, Mohab. author. Chawky, Sarah. author. Abdel Halim, Aya. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-93627-3
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