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Electronic apparatus and appliances -- Design and construction.
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1. 
Cover image for MEMS Packaging
MEMS Packaging
Author 
Tai-Ran Hsu, ed.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP003E
Format: 
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2. 
Cover image for Lead-free soldering in electronics : science, technology and environmental impact
Lead-free soldering in electronics : science, technology and environmental impact
Author 
Suganuma, Katsuaki.
Preferred Shelf Number 
TK7870.15 .L43 2004
Electronic Access 
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Format: 
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3. 
Cover image for Handbook of lead-free solder technology for microelectronic assemblies
Handbook of lead-free solder technology for microelectronic assemblies
Author 
Puttlitz, Karl J. Stalter, Kathleen A.
Preferred Shelf Number 
TK7870.15 .H3657 2004
Electronic Access 
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4. 
Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Author 
Lee, Ning-Cheng.
Preferred Shelf Number 
ONLINE
Electronic Access 
Volltext http://www.sciencedirect.com/science/book/9780750672184
Format: 
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5. 
Cover image for Run-to-run control in semiconductor manufacturing
Run-to-run control in semiconductor manufacturing
Author 
Del Castillo, Enrique. Hurwitz, Arnon Max. Moyne, James.
Preferred Shelf Number 
TK7871.85 .R863 2001
Electronic Access 
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6. 
Cover image for Microwave Field-Effect Transistors Theory, design and applications
Microwave Field-Effect Transistors Theory, design and applications
Author 
Pengelly, Raymond S.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/SBEW016E
Format: 
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