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13. 
Cover image for Modeling of film deposition for microelectronic applications
Modeling of film deposition for microelectronic applications
Author 
Rossnagel, Stephen M.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780125330220
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14. 
Cover image for Cryogenic Microelectronic Systems for Ultra-Low Energy and Enhanced Performance
Cryogenic Microelectronic Systems for Ultra-Low Energy and Enhanced Performance
Author 
Zhuldassov, Nurzhan. author. Friedman, Eby G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-90754-8
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15. 
Cover image for Silicon, from sand to chips. 1, Microelectronic components
Silicon, from sand to chips. 1, Microelectronic components
Author 
Vignes, Alain, author.
Preferred Shelf Number 
TK7871.15 .S55 V54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394297610
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16. 
Cover image for Silicon, from sand to chips. 2, Microelectronic chips, solar cells, MEMS
Silicon, from sand to chips. 2, Microelectronic chips, solar cells, MEMS
Author 
Vignes, Alain, author.
Preferred Shelf Number 
TK7871.15 .S55 V54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394297641
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17. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-658-41041-4
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18. 
Cover image for Microelectronic and signal processing : advanced concepts and applications
Microelectronic and signal processing : advanced concepts and applications
Author 
Goel, Sanket, editor.
Preferred Shelf Number 
TK5102.9 .M53 2021
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003168225
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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19. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
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20. 
Cover image for Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Author 
Liu, S. (Sheng), 1963- Liu, Yong, 1962- Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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21. 
Cover image for Handbook of lead-free solder technology for microelectronic assemblies
Handbook of lead-free solder technology for microelectronic assemblies
Author 
Puttlitz, Karl J. Stalter, Kathleen A.
Preferred Shelf Number 
TK7870.15 .H3657 2004
Electronic Access 
Click here to view.
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22. 
Cover image for Enhanced phase-locked loop structures for power and energy applications
Enhanced phase-locked loop structures for power and energy applications
Author 
Karimi-Ghartemani, Masoud, author.
Preferred Shelf Number 
ONLINE(341794.1)
Electronic Access 
Ebook Library http://public.eblib.com/choice/publicfullrecord.aspx?p=1658815
ebrary http://site.ebrary.com/id/10853333
John Wiley http://dx.doi.org/10.1002/9781118795187
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23. 
Cover image for CMOS circuit design, layout, and simulation
CMOS circuit design, layout, and simulation
Author 
Baker, R. Jacob, 1964- Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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24. 
Cover image for Advanced electronic packaging
Advanced electronic packaging
Author 
Ulrich, Richard K. (Richard Kevin), 1955- Brown, William D., 1943-
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522
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