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Cover image for Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Author 
Jamnia, Ali, 1961- author.
Preferred Shelf Number 
TK7870.15 .J36 2009
Electronic Access 
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2. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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3. 
Cover image for Degradation, stabilization, and recycling of packaging materials
Degradation, stabilization, and recycling of packaging materials
Author 
Rabnawaz, Muhammad, author. Selke, Susan E. M., author. Wyman, Ian, author.
Preferred Shelf Number 
TS198.2 .R33 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394294299
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4. 
Cover image for Applied circular economy engineering : technologies and business solutions to implement circularity
Applied circular economy engineering : technologies and business solutions to implement circularity
Preferred Shelf Number 
HC79 .E5 A67 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527847358
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5. 
Cover image for Pharmaceutical polymer formulations and its applications
Pharmaceutical polymer formulations and its applications
Author 
Keservani, Raj K., 1981- editor. Ahire, Eknath D., editor. Kesharwani, Rajesh Kumar, 1978- editor.
Preferred Shelf Number 
RS201 .P65 P43 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394172856
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6. 
Cover image for Green innovations for industrial development and business sustainability : models and implementation strategies
Green innovations for industrial development and business sustainability : models and implementation strategies
Author 
Sharma, Ravindra (Professor of management), editor. Rana, Geeta, editor. Agarwal, Shivani, editor.
Preferred Shelf Number 
HC79 .T4
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003458944
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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7. 
Cover image for EMERGING SUSTAINABLE AND RENEWABLE COMPOSITES from packaging to electronics.
EMERGING SUSTAINABLE AND RENEWABLE COMPOSITES from packaging to electronics.
Author 
Atiqah, A.
Preferred Shelf Number 
TA418.9 .C6
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003408215
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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8. 
Cover image for Thermal management materials for electronic packaging : preparation, characterization, and devices
Thermal management materials for electronic packaging : preparation, characterization, and devices
Author 
Tian, Xingyou, editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843121
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9. 
Cover image for High temperature polymer dielectrics : fundamentals and applications in power equipment
High temperature polymer dielectrics : fundamentals and applications in power equipment
Author 
Zha, Jun-Wei, editor Dang, Zhi-Min, editor
Preferred Shelf Number 
QC585 .H54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527841059
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10. 
Cover image for Design of power management integrated circuits
Design of power management integrated circuits
Author 
Wicht, B. (Bernhard), 1970- author.
Preferred Shelf Number 
TK7874 .W53 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119123095
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11. 
Cover image for Design of electromechanical products : an agile and systems approach
Design of electromechanical products : an agile and systems approach
Author 
Jamnia, Ali, 1961- author.
Preferred Shelf Number 
TK2331
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003301523
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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12. 
Cover image for Cognitive Systems and Information Processing 7th International Conference, ICCSIP 2022, Fuzhou, China, December 17-18, 2022, Revised Selected Papers
Cognitive Systems and Information Processing 7th International Conference, ICCSIP 2022, Fuzhou, China, December 17-18, 2022, Revised Selected Papers
Author 
Sun, Fuchun. editor. Cangelosi, Angelo. editor. Zhang, Jianwei. editor. Yu, Yuanlong. editor. Liu, Huaping. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0617-8
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