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13. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-78219-5
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14. 
Cover image for Fuel Cell Electronics Packaging
Fuel Cell Electronics Packaging
Author 
Kuang, Ken. editor. Easler, Keith. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47324-6
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15. 
Cover image for Innovations in food packaging
Innovations in food packaging
Author 
Han, Jung H.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780123116321
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16. 
Cover image for The electronic packaging handbook
The electronic packaging handbook
Author 
Blackwell, Glenn R.
Preferred Shelf Number 
ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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17. 
Cover image for Food packaging and preservation
Food packaging and preservation
Author 
Grumezescu, Alexandru Mihai, editor. Holban, Alina Maria, editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780128115169
ScienceDirect http://www.sciencedirect.com/science/book/9780128115169
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18. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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19. 
Cover image for Packaging for Food Preservation
Packaging for Food Preservation
Author 
Del Nobile, Matteo Alessandro. author. Conte, Amalia. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332324.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-7684-9
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20. 
Cover image for Paper and paperboard packaging technology
Paper and paperboard packaging technology
Author 
Kirwan, Mark J. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0802/2005006975-b.html
John Wiley http://dx.doi.org/10.1002/9780470995877
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21. 
Cover image for Handbook of aseptic processing and packaging
Handbook of aseptic processing and packaging
Author 
David, Jairus R. D. Graves, Ralph H. Szemplenski, Thomas.
Preferred Shelf Number 
ONLINE
Electronic Access 
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22. 
Cover image for The Wiley encyclopedia of packaging technology
The Wiley encyclopedia of packaging technology
Author 
Yam, Kit L.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9780470541395
Wiley http://onlinelibrary.wiley.com/book/10.1002/9780470541395
Knovel http://app.knovel.com/web/toc.v/cid:kpWEPTE002
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23. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-8884-1
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24. 
Cover image for Packaging yourself : the targeted resume
Packaging yourself : the targeted resume
Author 
Wendleton, Kate, author. Five O'Clock Club (New York, N.Y.), issuing body.
Preferred Shelf Number 
ONLINE(341070.1)
Electronic Access 
Available for Hacettepe University via Gale Virtual Reference Library. Click here to access
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