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13. 
Cover image for Global Exosome Trials
Global Exosome Trials
Author 
Weiss, Jeffrey N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-96420-6
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14. 
Cover image for The Sweetpotato Genome
The Sweetpotato Genome
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Yencho, G. Craig. editor. (orcid)0000-0001-6583-0628 Olukolu, Bode A. editor. (orcid)0000-0003-4143-8909 Isobe, Sachiko. editor. (orcid)0000-0002-9555-5054 SpringerLink (Online service)
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15. 
Cover image for Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 3
Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 3
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Bhateja, Vikrant. editor. Omar, Zaid. editor. Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893 Shrivastava, Sarika. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-7249-3
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16. 
Cover image for Innovation and Research - Smart Technologies and Systems Proceedings of the CI3 2024, Volume 1
Innovation and Research - Smart Technologies and Systems Proceedings of the CI3 2024, Volume 1
Author 
Vizuete, Marcelo Zambrano. editor. (orcid)0000-0001-5152-7572 Botto Tobar, Miguel. editor. (orcid)0000-0001-7494-5224 Casillas Martín, Sonia. editor. Gomes de Oliveira, Gabriel. editor. Durakovic, Benjamin. editor. (orcid)0000-0002-3099-0354
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https://doi.org/10.1007/978-3-031-99342-8
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17. 
Cover image for Neurologic Gene Therapy A Comprehensive Review of Global Clinical Trials
Neurologic Gene Therapy A Comprehensive Review of Global Clinical Trials
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Weiss, Jeffrey N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-96416-9
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18. 
Cover image for Evolution in Signal Processing and Telecommunication Networks Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Evolution in Signal Processing and Telecommunication Networks Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Author 
Bhateja, Vikrant. editor. (orcid)0000-0002-3259-8874 Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 Flores-Fuentes, Wendy. editor. (orcid)0000-0002-1477-7449 Urooj, Shabana. editor. (orcid)0000-0002-1477-8759 Sankar Dhar, Rudra. editor. (orcid)0000-0002-6571-3808
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https://doi.org/10.1007/978-981-97-0644-0
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19. 
Cover image for Model Tests and Numerical Simulations of Liquefaction and Lateral Spreading II LEAP-ASIA-2019
Model Tests and Numerical Simulations of Liquefaction and Lateral Spreading II LEAP-ASIA-2019
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Tobita, Tetsuo. editor. (orcid)0000-0002-1765-2721 Ichii, Koji. editor. Ueda, Kyohei. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-48821-4
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20. 
Cover image for Proceedings of the 3rd Annual International Conference on Material, Machines and Methods for Sustainable Development (MMMS2022) Volume 2: Materials Applications, Machining, and Renewable Energy
Proceedings of the 3rd Annual International Conference on Material, Machines and Methods for Sustainable Development (MMMS2022) Volume 2: Materials Applications, Machining, and Renewable Energy
Author 
Long, Banh Tien. editor. Ishizaki, Kozo. editor. Kim, Hyung Sun. editor. (orcid)0000-0003-1499-8484 Kim, Yun-Hae. editor. Toan, Nguyen Duc. editor. (orcid)0000-0001-9619-4476
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https://doi.org/10.1007/978-3-031-39090-6
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21. 
Cover image for Advances in Microelectronics, Embedded Systems and IoT Proceedings of 8th International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2023)
Advances in Microelectronics, Embedded Systems and IoT Proceedings of 8th International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2023)
Author 
Chakravarthy, V. V. S. S. S. editor. Bhateja, Vikrant. editor. (orcid)0000-0002-3259-8874 Anguera, Jaume. editor. Urooj, Shabana. editor. (orcid)0000-0002-1477-8759 Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893
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https://doi.org/10.1007/978-981-97-0767-6
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22. 
Cover image for Polysaccharide Based Films for Food Packaging: Fundamentals, Properties and Applications
Polysaccharide Based Films for Food Packaging: Fundamentals, Properties and Applications
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Amin, Tawheed. editor. (orcid)0000-0003-2919-7065 Naik, H. R. editor. Hussain, Syed Zameer. editor. (orcid)0000-0002-8542-7673 Wani, Sajad Mohd. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-4898-7
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23. 
Cover image for Pavement, Roadway, and Bridge Life Cycle Assessment 2024 ISPRB LCA
Pavement, Roadway, and Bridge Life Cycle Assessment 2024 ISPRB LCA
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Flintsch, Gerardo W. editor. Amarh, Eugene A. editor. Harvey, John. editor. Al-Qadi, Imad L. editor. Ozer, Hasan. editor.
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https://doi.org/10.1007/978-3-031-61585-6
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24. 
Cover image for Handbook of Spices in India: 75 Years of Research and Development
Handbook of Spices in India: 75 Years of Research and Development
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Ravindran, P N. editor. Sivaraman, K. editor. Devasahayam, S. editor. Babu, K Nirmal. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-3728-6
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