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13. 
Cover image for Datenaustausch in der Anlagenplanung mit AutomationML Integration von CAEX, PLCopen XML und COLLADA
Datenaustausch in der Anlagenplanung mit AutomationML Integration von CAEX, PLCopen XML und COLLADA
Author 
Draht, Rainer. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-04674-2
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14. 
Cover image for Composing Software Components A Software-testing Perspective
Composing Software Components A Software-testing Perspective
Author 
Hamlet, Dick. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7148-7
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15. 
Cover image for Analysis, Architectures and Modelling of Embedded Systems Third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, Langenargen, Germany, September 14-16, 2009. Proceedings
Analysis, Architectures and Modelling of Embedded Systems Third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, Langenargen, Germany, September 14-16, 2009. Proceedings
Author 
Rettberg, Achim. editor. Zanella, Mauro C. editor. Amann, Michael. editor. Keckeisen, Michael. editor. Rammig, Franz J. editor.
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http://dx.doi.org/10.1007/978-3-642-04284-3
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16. 
Cover image for SPS-Programmierung mit IEC 61131-3 Konzepte und Programmiersprachen, Anforderungen an Programmiersysteme, Entscheidungshilfen
SPS-Programmierung mit IEC 61131-3 Konzepte und Programmiersprachen, Anforderungen an Programmiersysteme, Entscheidungshilfen
Author 
Tiegelkamp, Michael. author. John, Karl Heinz. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-00269-4
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17. 
Cover image for Hardware Software Co-Design of a Multimedia SOC Platform
Hardware Software Co-Design of a Multimedia SOC Platform
Author 
Chen, Sao-Jie. author. Lin, Guang-Huei. author. Hsiung, Pao-Ann. author. Hu, Yu-Hen. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9623-5
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18. 
Cover image for Growth and Development of Computer-Aided Innovation Third IFIP WG 5.4 Working Conference, CAI 2009, Harbin, China, August 20-21, 2009. Proceedings
Growth and Development of Computer-Aided Innovation Third IFIP WG 5.4 Working Conference, CAI 2009, Harbin, China, August 20-21, 2009. Proceedings
Author 
Tan, Runhua. editor. Cao, Guozhong. editor. León, Noel. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-03346-9
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19. 
Cover image for Computer-Aided Innovation (CAI) IFIP 20th World Computer Congress, Proceedings of the Second Topical Session on Computer-Aided Innovation, WG 5.4/TC 5 Computer-Aided Innovation, September 7-10, 2008, Milano, Italy
Computer-Aided Innovation (CAI) IFIP 20th World Computer Congress, Proceedings of the Second Topical Session on Computer-Aided Innovation, WG 5.4/TC 5 Computer-Aided Innovation, September 7-10, 2008, Milano, Italy
Author 
Cascini, Gaetano. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-09697-1
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20. 
Cover image for Model-Driven Architecture in Practice A Software Production Environment Based on Conceptual Modeling
Model-Driven Architecture in Practice A Software Production Environment Based on Conceptual Modeling
Author 
Pastor, Oscar. author. Molina, Juan Carlos. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-71868-0
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21. 
Cover image for Design for Manufacturability and Yield for Nano-Scale CMOS
Design for Manufacturability and Yield for Nano-Scale CMOS
Author 
Chiang, Charles C. author. Kawa, Jamil. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-5188-3
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22. 
Cover image for Software Visualization Visualizing the Structure, Behaviour, and Evolution of Software
Software Visualization Visualizing the Structure, Behaviour, and Evolution of Software
Author 
Diehl, Stephan. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-46505-8
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23. 
Cover image for Functional Verification of Programmable Embedded Architectures A Top-Down Approach
Functional Verification of Programmable Embedded Architectures A Top-Down Approach
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Mishra, Prabhat. author. Dutt, Nikil D. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137514
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