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13. 
Cover image for VLSI-SoC: Design for Reliability, Security, and Low Power 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers
VLSI-SoC: Design for Reliability, Security, and Low Power 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers
Author 
Shin, Youngsoo. editor. Tsui, Chi Ying. editor. Kim, Jae-Joon. editor. Choi, Kiyoung. editor. Reis, Ricardo. editor. (orcid)0000-0001-5781-5858
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https://doi.org/10.1007/978-3-319-46097-0
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14. 
Cover image for Product Lifecycle Management for a Global Market 11th IFIP WG 5.1 International Conference, PLM 2014, Yokohama, Japan, July 7-9, 2014, Revised Selected Papers
Product Lifecycle Management for a Global Market 11th IFIP WG 5.1 International Conference, PLM 2014, Yokohama, Japan, July 7-9, 2014, Revised Selected Papers
Author 
Fukuda, Shuichi. editor. Bernard, Alain. editor. (orcid)0000-0002-7037-2980 Gurumoorthy, Balan. editor. Bouras, Abdelaziz. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-45937-9
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15. 
Cover image for Proceedings of 2024 International Conference on Medical Imaging and Computer-Aided Diagnosis (MICAD 2024) Medical Imaging and Computer-Aided Diagnosis
Proceedings of 2024 International Conference on Medical Imaging and Computer-Aided Diagnosis (MICAD 2024) Medical Imaging and Computer-Aided Diagnosis
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Su, Ruidan. editor. Frangi, Alejandro F. editor. Zhang, Yudong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-3863-5
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16. 
Cover image for Multimodality in Architecture Collaboration, Technology and Education
Multimodality in Architecture Collaboration, Technology and Education
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Lee, Ju Hyun. editor. (orcid)0000-0002-7159-426X Ostwald, Michael J. editor. (orcid)0000-0001-6210-6984 Kim, Mi Jeong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-49511-3
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17. 
Cover image for Product Lifecycle Management (Volume 7) PLM and Digital Twins
Product Lifecycle Management (Volume 7) PLM and Digital Twins
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Stark, John. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-63207-5
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18. 
Cover image for Novel Technology and Whole-Process Management in Prefabricated Building Conference Proceedings of The 5th International Prefabricated Building Seminar on Frontier Technology and Talent Training
Novel Technology and Whole-Process Management in Prefabricated Building Conference Proceedings of The 5th International Prefabricated Building Seminar on Frontier Technology and Talent Training
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Xiang, Ping. editor. (orcid)0000-0002-1636-4111 Zuo, Liangdong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-5108-2
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19. 
Cover image for Detection of Karst Voids at Deep Pile Foundation
Detection of Karst Voids at Deep Pile Foundation
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Liu, Liu. author. Shi, Zhenming. author. Peng, Ming. author. (orcid)0000-0001-9134-4391 Li, Shaojun. author. (orcid)0000-0002-9956-0205 Tao, Fengjuan. author.
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https://doi.org/10.1007/978-981-97-5834-0
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20. 
Cover image for Intelligent Manufacturing Systems in Industry 4.0 Select Proceedings of IPDIMS 2022
Intelligent Manufacturing Systems in Industry 4.0 Select Proceedings of IPDIMS 2022
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Deepak, B. B. V. L. editor. Bahubalendruni, M. V. A. Raju. editor. Parhi, D. R. K. editor. Biswal, B. B. editor. SpringerLink (Online service)
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21. 
Cover image for Model Design and Simulation Analysis 15th International Conference, AsiaSim 2015, Jeju, Korea, November 4-7, 2015, Revised Selected Papers
Model Design and Simulation Analysis 15th International Conference, AsiaSim 2015, Jeju, Korea, November 4-7, 2015, Revised Selected Papers
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Ohn, Syng Yup. editor. Chi, Sung Do. editor. SpringerLink (Online service)
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