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13. 
Cover image for High-Speed System and Analog Input/Output Design
High-Speed System and Analog Input/Output Design
Author 
Tran, Thanh T. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-04954-5
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14. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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15. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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16. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0357-3
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17. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
Author 
Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0408-2
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18. 
Cover image for System on Chip (SOC) Architecture A Practical Approach
System on Chip (SOC) Architecture A Practical Approach
Author 
Chakravarthi, Veena S. author. Koteshwar, Shivananda R. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-36242-2
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19. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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20. 
Cover image for Advances in Signal Processing, Embedded Systems and IoT Proceedings of Seventh ICMEET- 2022
Advances in Signal Processing, Embedded Systems and IoT Proceedings of Seventh ICMEET- 2022
Author 
Chakravarthy, V.V.S.S.S. editor. Bhateja, Vikrant. editor. Flores Fuentes, Wendy. editor. Anguera, Jaume. editor. Vasavi, K. Padma. editor.
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https://doi.org/10.1007/978-981-19-8865-3
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21. 
Cover image for Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Author 
Cocorullo, Giuseppe. editor. Crupi, Felice. editor. Limiti, Ernesto. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26066-7
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22. 
Cover image for Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Author 
Banerjee, Amal. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-08778-3
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23. 
Cover image for Essential Circuit Analysis using LTspice®
Essential Circuit Analysis using LTspice®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-09853-6
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24. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-12818-9
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