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25. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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26. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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27. 
Cover image for Managing More-than-Moore Integration Technology Development A Story of an Advanced Technology Program in the Semiconductor Industry
Managing More-than-Moore Integration Technology Development A Story of an Advanced Technology Program in the Semiconductor Industry
Author 
Radojcic, Riko. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-92701-5
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28. 
Cover image for Device Physics, Modeling, Technology, and Analysis for Silicon MESFET
Device Physics, Modeling, Technology, and Analysis for Silicon MESFET
Author 
Amiri, Iraj Sadegh. author. Mohammadi, Hossein. author. Hosseinghadiry, Mahdiar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-04513-5
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29. 
Cover image for Emerging Technology and Architecture for Big-data Analytics
Emerging Technology and Architecture for Big-data Analytics
Author 
Chattopadhyay, Anupam. editor. (orcid)0000-0002-8818-6983 Chang, Chip Hong. editor. Yu, Hao. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-54840-1
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30. 
Cover image for Intellectual Property and Financing Strategies for Technology Startups
Intellectual Property and Financing Strategies for Technology Startups
Author 
Halt, Jr., Gerald B. author. Donch, Jr., John C. author. Stiles, Amber R. author. Fesnak, Robert. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-49217-9
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31. 
Cover image for Micro-Relay Technology for Energy-Efficient Integrated Circuits
Micro-Relay Technology for Energy-Efficient Integrated Circuits
Author 
Kam, Hei. author. Chen, Fred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2128-7
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32. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9266-5
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33. 
Cover image for Intellectual Property in Consumer Electronics, Software and Technology Startups
Intellectual Property in Consumer Electronics, Software and Technology Startups
Author 
Halt, Jr., Gerald B. author. Donch, Jr., John C. author. Stiles, Amber R. author. Fesnak, Robert. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-7912-3
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34. 
Cover image for Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Author 
Balasinski, Artur. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-1761-3
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35. 
Cover image for Switched-Currents An analogue technique for digital technology
Switched-Currents An analogue technique for digital technology
Author 
Toumazou, C., ed. Hughes, J. B., ed. Battersby, N. C., ed.
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http://dx.doi.org/10.1049/PBCS005E
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36. 
Cover image for RF, Microwave and Millimeter Wave Technologies
RF, Microwave and Millimeter Wave Technologies
Author 
Kumar, Hemant. editor. Gopi, E. S. editor. (orcid)0000-0001-7502-6756 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-62526-8
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