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13. 
Cover image for Pyroelectric materials : physics and applications
Pyroelectric materials : physics and applications
Author 
Bain, Ashim Kumar, author. Chand, Prem, author.
Preferred Shelf Number 
QC338.5 .P95
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527839742
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14. 
Cover image for Introduction to quantum mechanics. 2, Wave-corpuscle, quantization and Schrödinger's equation
Introduction to quantum mechanics. 2, Wave-corpuscle, quantization and Schrödinger's equation
Author 
Sakho, Ibrahima.
Preferred Shelf Number 
QC174.12
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119694939
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15. 
Cover image for Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Author 
Cheng, Jie. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-6165-3
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16. 
Cover image for Handbook of Modern Sensors Physics, Designs, and Applications
Handbook of Modern Sensors Physics, Designs, and Applications
Author 
Fraden, Jacob. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-19303-8
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17. 
Cover image for Sensing Technology: Current Status and Future Trends III
Sensing Technology: Current Status and Future Trends III
Author 
Mason, Alex. editor. Mukhopadhyay, Subhas Chandra. editor. Jayasundera, Krishanthi Padmarani. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-10948-0
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18. 
Cover image for Sensing Technology: Current Status and Future Trends IV
Sensing Technology: Current Status and Future Trends IV
Author 
Mason, Alex. editor. Mukhopadhyay, Subhas Chandra. editor. Jayasundera, Krishanthi Padmarani. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
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https://doi.org/10.1007/978-3-319-12898-6
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19. 
Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author 
Kondo, Kazuo. editor. Akolkar, Rohan N. editor. Barkey, Dale P. editor. Yokoi, Masayuki. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-1-4614-9176-7
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20. 
Cover image for Solid State Gas Sensors - Industrial Application
Solid State Gas Sensors - Industrial Application
Author 
Fleischer, Maximilian. editor. Lehmann, Mirko. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-28093-1
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21. 
Cover image for Reinraumtechnik
Reinraumtechnik
Author 
Gail, Lothar. editor. Gommel, Udo. editor. Hortig, Hans-Peter. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-19435-1
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22. 
Cover image for Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Author 
He, Ming. author. Lu, Toh-Ming. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1812-2
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23. 
Cover image for Coronal Mass Ejections An Introduction
Coronal Mass Ejections An Introduction
Author 
Howard, Timothy. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-8789-1
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24. 
Cover image for Springer Handbook of Nanotechnology
Springer Handbook of Nanotechnology
Author 
Bhushan, Bharat. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-02525-9
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