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1. 
Cover image for Languages, Design Methods, and Tools for Electronic System Design Selected Contributions from FDL 2013
Languages, Design Methods, and Tools for Electronic System Design Selected Contributions from FDL 2013
Author 
Louërat, Marie-Minerve. editor. Maehne, Torsten. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06317-1
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2. 
Cover image for Low Power Interconnect Design
Low Power Interconnect Design
Author 
Saini, Sandeep. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-1323-3
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3. 
Cover image for FPGA Based Accelerators for Financial Applications
FPGA Based Accelerators for Financial Applications
Author 
De Schryver, Christian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-15407-7
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4. 
Cover image for Multi-Net Optimization of VLSI Interconnect
Multi-Net Optimization of VLSI Interconnect
Author 
Moiseev, Konstantin. author. Kolodny, Avinoam. author. Wimer, Shmuel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-0821-5
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5. 
Cover image for More than Moore Technologies for Next Generation Computer Design
More than Moore Technologies for Next Generation Computer Design
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Topaloglu, Rasit O. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2163-8
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6. 
Cover image for FPGA Design Best Practices for Team-based Reuse
FPGA Design Best Practices for Team-based Reuse
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Simpson, Philip Andrew. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17924-7
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7. 
Cover image for Engineering Embedded Systems Physics, Programs, Circuits
Engineering Embedded Systems Physics, Programs, Circuits
Author 
Hintenaus, Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-10680-9
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8. 
Cover image for Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Author 
Sobh, Tarek. editor. Elleithy, Khaled. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06773-5
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