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13. 
Cover image for Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Author 
Philippe, Bart. author. Reynaert, Patrick. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-11224-9
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14. 
Cover image for Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Author 
Cocorullo, Giuseppe. editor. Crupi, Felice. editor. Limiti, Ernesto. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26066-7
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15. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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16. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2308-1
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17. 
Cover image for Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
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Keller, Reto B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-14186-7
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18. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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19. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0357-3
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20. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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21. 
Cover image for Topics in LC Oscillators Principles, Phase Noise, Pulling, Inductor Design
Topics in LC Oscillators Principles, Phase Noise, Pulling, Inductor Design
Author 
Manetakis, Konstantinos. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-31086-7
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22. 
Cover image for Advances in Signal Processing, Embedded Systems and IoT Proceedings of Seventh ICMEET- 2022
Advances in Signal Processing, Embedded Systems and IoT Proceedings of Seventh ICMEET- 2022
Author 
Chakravarthy, V.V.S.S.S. editor. Bhateja, Vikrant. editor. Flores Fuentes, Wendy. editor. Anguera, Jaume. editor. Vasavi, K. Padma. editor.
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https://doi.org/10.1007/978-981-19-8865-3
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23. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-12818-9
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24. 
Cover image for Software Defined Chips Volume II
Software Defined Chips Volume II
Author 
Liu, Leibo. author. Wei, Shaojun. author. Zhu, Jianfeng. author. Deng, Chenchen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-7636-0
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