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1. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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Cover image for Power Management of Digital Circuits in Deep Sub-Micron CMOS Technologies
Power Management of Digital Circuits in Deep Sub-Micron CMOS Technologies
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Henzler, Stephan. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-5081-X
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3. 
Cover image for Introduction to Avionics Systems
Introduction to Avionics Systems
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Collinson, R.P.G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-29215-6
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4. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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5. 
Cover image for Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
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Siano, Pierluigi. editor. Williamson, Sheldon. editor. Beevi, Sabeena. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0915-5
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6. 
Cover image for Gain-Cell Embedded DRAMs for Low-Power VLSI Systems-on-Chip
Gain-Cell Embedded DRAMs for Low-Power VLSI Systems-on-Chip
Author 
Meinerzhagen, Pascal. author. Teman, Adam. author. Giterman, Robert. author. Edri, Noa. author. Burg, Andreas. author.
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https://doi.org/10.1007/978-3-319-60402-2
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7. 
Cover image for Digital Storage in Consumer Electronics The Essential Guide
Digital Storage in Consumer Electronics The Essential Guide
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Coughlin, Thomas M. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-69907-3
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8. 
Cover image for The Malaysia-Japan Model on Technology Partnership International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference
The Malaysia-Japan Model on Technology Partnership International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference
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Ab. Hamid, Khairuddin. editor. Ono, Osamu. editor. Bostamam, Anas Muhamad. editor. Poh Ai Ling, Amy. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-54439-5
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9. 
Cover image for FPGA Design Best Practices for Team-based Reuse
FPGA Design Best Practices for Team-based Reuse
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Simpson, Philip Andrew. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17924-7
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10. 
Cover image for Ultra-Low-Voltage Design of Energy-Efficient Digital Circuits
Ultra-Low-Voltage Design of Energy-Efficient Digital Circuits
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Reynders, Nele. author. Dehaene, Wim. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-16136-5
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11. 
Cover image for Trusted Computing for Embedded Systems
Trusted Computing for Embedded Systems
Author 
Candaele, Bernard. editor. Soudris, Dimitrios. editor. Anagnostopoulos, Iraklis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09420-5
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12. 
Cover image for Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Author 
Sobh, Tarek. editor. Elleithy, Khaled. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06773-5
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