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13. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1053-9
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14. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
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15. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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16. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-235-7
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17. 
Cover image for Sensing technologies for real time monitoring of water quality
Sensing technologies for real time monitoring of water quality
Author 
Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.
Preferred Shelf Number 
TD367 .M3175 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843
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18. 
Cover image for Substrate-integrated millimeter-wave antennas for next-generation communication and radar systems
Substrate-integrated millimeter-wave antennas for next-generation communication and radar systems
Author 
Chen, Zhi Ning, editor. Qing, Xianming, editor. John Wiley & Sons, publisher.
Preferred Shelf Number 
TK7871.6 .S83 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119611165
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19. 
Cover image for The ESD control program handbook
The ESD control program handbook
Author 
Smallwood, J. M. (Jeremy M.), author.
Preferred Shelf Number 
TK7870
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781118694541
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20. 
Cover image for Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
Author 
Domingo, George, 1937- author.
Preferred Shelf Number 
TK7871.85 .D66 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119597124
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