Limit Search Results
Author
Language
Publication Date
-
Subject
Electronics and Microelectronics, Instrumentation.
(11)
Optical materials.
(9)
Electronic Circuits and Systems.
(8)
Electronic circuits.
(8)
Engineering.
(7)
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
Select an Action
28 Results Found Subscribe to search results
000000000000DEFAULT
Print
13. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
Format: 
Availability 
Online Library~1
Available:
Copies:
14. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
Format: 
Availability 
Online Library~1
Available:
Copies:
15. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1556-9
Format: 
Availability 
Online Library~1
Available:
Copies:
16. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1053-9
Format: 
Availability 
Online Library~1
Available:
Copies:
17. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
Format: 
Availability 
Online Library~1
Available:
Copies:
18. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
Format: 
Availability 
Online Library~1
Available:
Copies:
19. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-235-7
Format: 
Availability 
Online Library~1
Available:
Copies:
20. 
Cover image for Nanometer CMOS ICs From Basics to ASICs
Nanometer CMOS ICs From Basics to ASICs
Author 
Veendrick, Harry. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-64249-4
Format: 
Availability 
Online Library~1
Available:
Copies:
21. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4166-6
Format: 
Availability 
Online Library~1
Available:
Copies:
22. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-2140-5
Format: 
Availability 
Online Library~1
Available:
Copies:
23. 
Cover image for Sensing technologies for real time monitoring of water quality
Sensing technologies for real time monitoring of water quality
Author 
Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.
Preferred Shelf Number 
TD367 .M3175 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843
Format: 
Availability 
Online Library~1
Available:
Copies:
24. 
Cover image for Substrate-integrated millimeter-wave antennas for next-generation communication and radar systems
Substrate-integrated millimeter-wave antennas for next-generation communication and radar systems
Author 
Chen, Zhi Ning, editor. Qing, Xianming, editor. John Wiley & Sons, publisher.
Preferred Shelf Number 
TK7871.6 .S83 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119611165
Format: 
Availability 
Online Library~1
Available:
Copies: