Limit Search Results
Author
SpringerLink (Online service)
(33)
Birolini, Alessandro. author.
(3)
De Doncker, Rik. author.
(2)
Liu, Yong. author.
(2)
Lutz, Josef. author.
(2)
Language
Publication Date
-
Subject
Engineering.
(17)
Electronics and Microelectronics, Instrumentation.
(13)
Optical materials.
(12)
System safety.
(11)
Electronic circuits.
(8)
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
Select an Action
33 Results Found Subscribe to search results
000000000000DEFAULT
Print
1. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-38892-2
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-310-7
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Solid State Lighting Reliability Part 2 Components to Systems
Solid State Lighting Reliability Part 2 Components to Systems
Author 
van Driel, Willem Dirk. editor. Fan, Xuejun. editor. Zhang, Guo Qi. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-58175-0
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9266-5
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Author 
Ueda, Osamu. editor. Pearton, Stephen J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331478.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-4337-7
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J. W. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332682.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-00122-7
Format: 
Availability 
Online Library~1
Available:
Copies:
7. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1053-9
Format: 
Availability 
Online Library~1
Available:
Copies:
8. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J.W. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-6348-2
Format: 
Availability 
Online Library~1
Available:
Copies:
9. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
Format: 
Availability 
Online Library~1
Available:
Copies:
10. 
Cover image for A Guide to Lead-free Solders Physical Metallurgy and Reliability
A Guide to Lead-free Solders Physical Metallurgy and Reliability
Author 
Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-84628-310-9
Format: 
Availability 
Online Library~1
Available:
Copies:
11. 
Cover image for Measurement Uncertainty An Approach via the Mathematical Theory of Evidence
Measurement Uncertainty An Approach via the Mathematical Theory of Evidence
Author 
Salicone, Simona. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-46328-5
Format: 
Availability 
Online Library~1
Available:
Copies:
12. 
Cover image for Software Defined Chips Volume II
Software Defined Chips Volume II
Author 
Liu, Leibo. author. Wei, Shaojun. author. Zhu, Jianfeng. author. Deng, Chenchen. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-7636-0
Format: 
Availability 
Online Library~1
Available:
Copies: