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13. 
Cover image for Flexible Electronics Materials and Applications
Flexible Electronics Materials and Applications
Author 
Salleo, Alberto. editor. Wong, William S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-74363-9
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14. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
Author 
Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76534-1
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15. 
Cover image for Polymer Engineering Technologien und Praxis
Polymer Engineering Technologien und Praxis
Author 
Eyerer, Peter. author. Elsner, Peter. author. Hirth, Thomas. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-72419-3
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16. 
Cover image for Nanotribology and Nanomechanics An Introduction
Nanotribology and Nanomechanics An Introduction
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Bhushan, Bharat. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-77608-6
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17. 
Cover image for Semiconductor Nanostructures
Semiconductor Nanostructures
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Bimberg, Dieter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-77899-8
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18. 
Cover image for Nanoscale Phenomena Basic Science to Device Applications
Nanoscale Phenomena Basic Science to Device Applications
Author 
Tang, Zikang. editor. Sheng, Ping. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-73048-6
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19. 
Cover image for Springer Handbook of Electronic and Photonic Materials
Springer Handbook of Electronic and Photonic Materials
Author 
Kasap, Safa. editor. Capper, Peter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-29185-7
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20. 
Cover image for Fundamentals of Nanoscale Film Analysis
Fundamentals of Nanoscale Film Analysis
Author 
Alford, Terry L. author. Feldman, Leonard C. author. Mayer, James W. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-29261-8
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21. 
Cover image for Physics of Ferroelectrics A Modern Perspective
Physics of Ferroelectrics A Modern Perspective
Author 
Rabe, Karin M. editor. Ahn, Charles H. editor. Triscone, Jean-Marc. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-34591-6
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22. 
Cover image for Laser Ablation and its Applications
Laser Ablation and its Applications
Author 
Phipps, Claude. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-30453-3
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23. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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24. 
Cover image for Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Author 
Laconte, J. author. Flandre, D. author. Raskin, J. -P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-28843-0
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