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13. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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14. 
Cover image for Ermüdungsfestigkeit Grundlagen für Ingenieure
Ermüdungsfestigkeit Grundlagen für Ingenieure
Author 
Radaj, Dieter. author. Vormwald, Michael. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-71459-0
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15. 
Cover image for Betriebsfestigkeit Verfahren und Daten zur Bauteilberechnung
Betriebsfestigkeit Verfahren und Daten zur Bauteilberechnung
Author 
Haibach, Erwin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/3-540-29364-7
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16. 
Cover image for Eisenwerkstoffe — Stahl und Gusseisen
Eisenwerkstoffe — Stahl und Gusseisen
Author 
Berns, Hans. author. Theisen, Werner. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/3-540-29793-6
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17. 
Cover image for Kleben Grundlagen, Technologien, Anwendungen
Kleben Grundlagen, Technologien, Anwendungen
Author 
Habenicht, Gerd. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/3-540-31223-4
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18. 
Cover image for Make and Test Projects in Engineering Design Creativity, Engagement and Learning
Make and Test Projects in Engineering Design Creativity, Engagement and Learning
Author 
Samuel, Andrew Emery. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-285-3
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