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1. 
Cover image for Proceedings of the 1st International Conference on Fluid, Thermal and Energy Systems ICFTES 2022
Proceedings of the 1st International Conference on Fluid, Thermal and Energy Systems ICFTES 2022
Author 
Das, Sudev. editor. (orcid)0000-0001-9774-4150 Mangadoddy, Narasimha. editor. (orcid)0000-0002-3123-2811 Hoffmann, Jaap. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-5990-7
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2. 
Cover image for A Thermodynamic Introduction to Transport Phenomena
A Thermodynamic Introduction to Transport Phenomena
Author 
Struchtrup, Henning. author. (orcid)0000-0002-4986-0728 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-61868-0
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3. 
Cover image for Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 6 Proceedings of the 2022 Annual Conference on Experimental and Applied Mechanics
Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 6 Proceedings of the 2022 Annual Conference on Experimental and Applied Mechanics
Author 
Tighe, Rachael C. editor. Considine, John. editor. Kramer, Sharlotte L.B. editor. Berfield, Tom. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-17475-9
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4. 
Cover image for Computational Fluid Dynamics Incompressible Turbulent Flows
Computational Fluid Dynamics Incompressible Turbulent Flows
Author 
Kajishima, Takeo. author. Taira, Kunihiko. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45304-0
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5. 
Cover image for Dynamics of Nanoparticles in Stagnation Flames
Dynamics of Nanoparticles in Stagnation Flames
Author 
Zhang, Yiyang. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-53615-5
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6. 
Cover image for Analytical Heat and Fluid Flow in Microchannels and Microsystems
Analytical Heat and Fluid Flow in Microchannels and Microsystems
Author 
Cotta, Renato M. author. Knupp, Diego C. author. Naveira-Cotta, Carolina P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-23312-3
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7. 
Cover image for A Thermochemical Heat Storage System for Households Combined Investigations of Thermal Transfers Coupled to Chemical Reactions
A Thermochemical Heat Storage System for Households Combined Investigations of Thermal Transfers Coupled to Chemical Reactions
Author 
Fopah Lele, Armand. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-41228-3
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8. 
Cover image for Modeling Thermodynamic Distance, Curvature and Fluctuations A Geometric Approach
Modeling Thermodynamic Distance, Curvature and Fluctuations A Geometric Approach
Author 
Badescu, Viorel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-33789-0
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9. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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10. 
Cover image for Thermal Sensors Principles and Applications for Semiconductor Industries
Thermal Sensors Principles and Applications for Semiconductor Industries
Author 
Jha, Chandra Mohan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2581-0
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