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1. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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2. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44586-1
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3. 
Cover image for Outlook and Challenges of Nano Devices, Sensors, and MEMS
Outlook and Challenges of Nano Devices, Sensors, and MEMS
Author 
Li, Ting. editor. Liu, Ziv. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-50824-5
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4. 
Cover image for Next Generation Spin Torque Memories
Next Generation Spin Torque Memories
Author 
Kaushik, Brajesh Kumar. author. Verma, Shivam. author. Kulkarni, Anant Aravind. author. Prajapati, Sanjay. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-10-2720-8
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5. 
Cover image for Frontiers in Electronic Technologies Trends and Challenges
Frontiers in Electronic Technologies Trends and Challenges
Author 
Prabaharan, S.R.S. editor. Thalmann, Nadia Magnenat. editor. (orcid)0000-0002-1459-5960 Kanchana Bhaaskaran, V. S. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-4235-5
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6. 
Cover image for Implantable Medical Electronics Prosthetics, Drug Delivery, and Health Monitoring
Implantable Medical Electronics Prosthetics, Drug Delivery, and Health Monitoring
Author 
Khanna, Vinod Kumar. author. (orcid)0000-0001-7536-4798 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-25448-7
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7. 
Cover image for Memristor-Based Nanoelectronic Computing Circuits and Architectures Foreword by Leon Chua
Memristor-Based Nanoelectronic Computing Circuits and Architectures Foreword by Leon Chua
Author 
Vourkas, Ioannis. author. Sirakoulis, Georgios Ch. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-22647-7
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8. 
Cover image for Nonsmooth Mechanics Models, Dynamics and Control
Nonsmooth Mechanics Models, Dynamics and Control
Author 
Brogliato, Bernard. author. (orcid)0000-0002-6193-9404 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-28664-8
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9. 
Cover image for Crosstalk in Modern On-Chip Interconnects A FDTD Approach
Crosstalk in Modern On-Chip Interconnects A FDTD Approach
Author 
Kaushik, B.K. author. Kumar, V. Ramesh. author. Patnaik, Amalendu. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-0800-9
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10. 
Cover image for Micro-Relay Technology for Energy-Efficient Integrated Circuits
Micro-Relay Technology for Energy-Efficient Integrated Circuits
Author 
Kam, Hei. author. Chen, Fred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2128-7
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11. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-25376-8
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12. 
Cover image for Introduction to Microsystem Design
Introduction to Microsystem Design
Author 
Schomburg, Werner Karl. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-47023-7
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