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1. 
Cover image for Nanofabrication Principles, Capabilities and Limits
Nanofabrication Principles, Capabilities and Limits
Author 
Cui, Zheng. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-39361-2
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2. 
Cover image for Advances in Neuromorphic Hardware Exploiting Emerging Nanoscale Devices
Advances in Neuromorphic Hardware Exploiting Emerging Nanoscale Devices
Author 
Suri, Manan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-3703-7
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3. 
Cover image for Nanovate Commercializing Disruptive Nanotechnologies
Nanovate Commercializing Disruptive Nanotechnologies
Author 
Anis, Mohab. author. AlTaher, Ghada. author. Sarhan, Wesam. author. Elsemary, Mona. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44863-3
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4. 
Cover image for Next Generation Spin Torque Memories
Next Generation Spin Torque Memories
Author 
Kaushik, Brajesh Kumar. author. Verma, Shivam. author. Kulkarni, Anant Aravind. author. Prajapati, Sanjay. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-2720-8
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5. 
Cover image for Crosstalk in Modern On-Chip Interconnects A FDTD Approach
Crosstalk in Modern On-Chip Interconnects A FDTD Approach
Author 
Kaushik, B.K. author. Kumar, V. Ramesh. author. Patnaik, Amalendu. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-0800-9
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6. 
Cover image for Memristor-Based Nanoelectronic Computing Circuits and Architectures Foreword by Leon Chua
Memristor-Based Nanoelectronic Computing Circuits and Architectures Foreword by Leon Chua
Author 
Vourkas, Ioannis. author. Sirakoulis, Georgios Ch. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-22647-7
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7. 
Cover image for Micro-Relay Technology for Energy-Efficient Integrated Circuits
Micro-Relay Technology for Energy-Efficient Integrated Circuits
Author 
Kam, Hei. author. Chen, Fred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2128-7
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8. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-25376-8
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9. 
Cover image for Carbon for Sensing Devices
Carbon for Sensing Devices
Author 
Demarchi, Danilo. editor. Tagliaferro, Alberto. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08648-4
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10. 
Cover image for Introduction to Microsystem Design
Introduction to Microsystem Design
Author 
Schomburg, Werner Karl. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-47023-7
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11. 
Cover image for Comparators in Nanometer CMOS Technology
Comparators in Nanometer CMOS Technology
Author 
Goll, Bernhard. author. Zimmermann, Horst. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-44482-5
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12. 
Cover image for Carbon Nanotube Based VLSI Interconnects Analysis and Design
Carbon Nanotube Based VLSI Interconnects Analysis and Design
Author 
Kaushik, Brajesh Kumar. author. Majumder, Manoj Kumar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-2047-3
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