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13. 
Cover image for Magnetic Particle Imaging A Novel SPIO Nanoparticle Imaging Technique
Magnetic Particle Imaging A Novel SPIO Nanoparticle Imaging Technique
Author 
Buzug, Thorsten M. editor. Borgert, Jörn. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-24133-8
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14. 
Cover image for Physics and Engineering of New Materials
Physics and Engineering of New Materials
Author 
Cat, Do Tran. editor. Pucci, Annemarie. editor. Wandelt, Klaus. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-88201-5
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15. 
Cover image for Advances in Nanoscale Magnetism Proceedings of the International Conference on Nanoscale Magnetism ICNM-2007 June 25–29, Istanbul, Turkey
Advances in Nanoscale Magnetism Proceedings of the International Conference on Nanoscale Magnetism ICNM-2007 June 25–29, Istanbul, Turkey
Author 
Aktas, Bekir. editor. Mikailov, Faik. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-69882-1
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16. 
Cover image for Single Molecules and Nanotechnology
Single Molecules and Nanotechnology
Author 
Rigler, R. editor. Vogel, H. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-73924-1
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17. 
Cover image for Computational Continuum Mechanics of Nanoscopic Structures Nonlocal Elasticity Approaches
Computational Continuum Mechanics of Nanoscopic Structures Nonlocal Elasticity Approaches
Author 
Ghavanloo, Esmaeal. author. Rafii-Tabar, Hashem. author. Fazelzadeh, Seyed Ahmad. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-11650-7
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18. 
Cover image for A Practical Guide to Design for Additive Manufacturing
A Practical Guide to Design for Additive Manufacturing
Author 
Diegel, Olaf. author. Nordin, Axel. author. Motte, Damien. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-8281-9
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19. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77872-3
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20. 
Cover image for Micro and Smart Devices and Systems
Micro and Smart Devices and Systems
Author 
Vinoy, K. J. editor. Ananthasuresh, G. K. editor. Pratap, Rudra. editor. Krupanidhi, S. B. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-1913-2
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21. 
Cover image for Micro-scaled Products Development via Microforming Deformation Behaviours, Processes, Tooling and its Realization
Micro-scaled Products Development via Microforming Deformation Behaviours, Processes, Tooling and its Realization
Author 
Fu, Ming Wang. author. Chan, Wai Lun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4471-6326-8
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22. 
Cover image for Protein nanotechnology : protocols, instrumentation, and applications
Protein nanotechnology : protocols, instrumentation, and applications
Author 
Gerrard, Juliet A., editor of compilation.
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QP551 P76 2013
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23. 
Cover image for Silicon-based Nanomaterials
Silicon-based Nanomaterials
Author 
Li, Handong. editor. Wu, Jiang. editor. Wang, Zhiming M. editor. SpringerLink (Online service)
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ONLINE(332396.1)
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http://dx.doi.org/10.1007/978-1-4614-8169-0
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24. 
Cover image for Optical Absorption of Impurities and Defects in Semiconducting Crystals Electronic Absorption of Deep Centres and Vibrational Spectra
Optical Absorption of Impurities and Defects in Semiconducting Crystals Electronic Absorption of Deep Centres and Vibrational Spectra
Author 
Pajot, Bernard. author. Clerjaud, Bernard. author. SpringerLink (Online service)
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ONLINE(333081.1)
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http://dx.doi.org/10.1007/978-3-642-18018-7
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