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1. 
Cover image for Modern Aspects of Josephson Dynamics and Superconductivity Electronics
Modern Aspects of Josephson Dynamics and Superconductivity Electronics
Author 
Askerzade, Iman. author. Bozbey, Ali. author. Cantürk, Mehmet. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-48433-4
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2. 
Cover image for Functional Nanomaterials and Devices for Electronics, Sensors and Energy Harvesting
Functional Nanomaterials and Devices for Electronics, Sensors and Energy Harvesting
Author 
Nazarov, Alexei. editor. Balestra, Francis. editor. Kilchytska, Valeriya. editor. Flandre, Denis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08804-4
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3. 
Cover image for Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Author 
Cantatore, Eugenio. editor. SpringerLink (Online service)
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ONLINE(331320.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3160-2
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4. 
Cover image for Energy Level Alignment and Electron Transport Through Metal/Organic Contacts From Interfaces to Molecular Electronics
Energy Level Alignment and Electron Transport Through Metal/Organic Contacts From Interfaces to Molecular Electronics
Author 
Abad, Enrique. author. SpringerLink (Online service)
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ONLINE(333371.1)
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http://dx.doi.org/10.1007/978-3-642-30907-6
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5. 
Cover image for Unimolecular and Supramolecular Electronics II Chemistry and Physics Meet at Metal-Molecule Interfaces
Unimolecular and Supramolecular Electronics II Chemistry and Physics Meet at Metal-Molecule Interfaces
Author 
Metzger, Robert M. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-27398-8
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6. 
Cover image for Unimolecular and Supramolecular Electronics I Chemistry and Physics Meet at Metal-Molecule Interfaces
Unimolecular and Supramolecular Electronics I Chemistry and Physics Meet at Metal-Molecule Interfaces
Author 
Metzger, Robert M. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-27284-4
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7. 
Cover image for Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Author 
He, Ming. author. Lu, Toh-Ming. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1812-2
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8. 
Cover image for Global Life Cycle Impact Assessments of Material Shifts The Example of a Lead-free Electronics Industry
Global Life Cycle Impact Assessments of Material Shifts The Example of a Lead-free Electronics Industry
Author 
Andrae, A.S.G. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-661-8
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9. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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10. 
Cover image for Gallium Nitride Processing for Electronics, Sensors and Spintronics
Gallium Nitride Processing for Electronics, Sensors and Spintronics
Author 
Pearton, Stephen J. author. Abernathy, Cammy R. author. Ren, Fan. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-84628-359-0
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11. 
Cover image for Power GaN Devices Materials, Applications and Reliability
Power GaN Devices Materials, Applications and Reliability
Author 
Meneghini, Matteo. editor. Meneghesso, Gaudenzio. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-43199-4
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12. 
Cover image for Fundamentals of Solid State Engineering
Fundamentals of Solid State Engineering
Author 
Razeghi, Manijeh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-75708-7
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