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13. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE(330808.1)
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http://dx.doi.org/10.1007/978-1-4419-5768-9
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14. 
Cover image for Electromagnetic Behaviour of Metallic Wire Structures
Electromagnetic Behaviour of Metallic Wire Structures
Author 
Chui, S. T. author. Zhou, Lei. author. SpringerLink (Online service)
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ONLINE(330920.1)
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http://dx.doi.org/10.1007/978-1-4471-4159-4
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15. 
Cover image for Solid State Lighting Reliability Components to Systems
Solid State Lighting Reliability Components to Systems
Author 
van Driel, W.D. editor. Fan, X.J. editor. SpringerLink (Online service)
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ONLINE(331314.1)
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http://dx.doi.org/10.1007/978-1-4614-3067-4
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16. 
Cover image for Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Author 
Cantatore, Eugenio. editor. SpringerLink (Online service)
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ONLINE(331320.1)
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http://dx.doi.org/10.1007/978-1-4614-3160-2
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17. 
Cover image for Lead-Free Piezoelectrics
Lead-Free Piezoelectrics
Author 
Priya, Shashank. editor. Nahm, Sahn. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-9598-8
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18. 
Cover image for Power generation handbook fundamentals of low-emission, high-efficiency power plant operation
Power generation handbook fundamentals of low-emission, high-efficiency power plant operation
Author 
Kiameh, Philip.
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ONLINE
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19. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
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Pang, John Hock Lye. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4614-0463-7
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20. 
Cover image for Systems engineering for microscale and nanoscale technologies
Systems engineering for microscale and nanoscale technologies
Author 
Darrin, M. Ann Garrison. Barth, Janet L.
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TA418.9 .N35 S983 2012
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21. 
Cover image for Microelectronic Test Structures for CMOS Technology
Microelectronic Test Structures for CMOS Technology
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-9377-9
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22. 
Cover image for Introduction to Microsystem Design
Introduction to Microsystem Design
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Schomburg, Werner Karl. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-19489-4
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23. 
Cover image for Sensors and Microsystems AISEM 2010 Proceedings
Sensors and Microsystems AISEM 2010 Proceedings
Author 
Neri, Giovanni. editor. Donato, Nicola. editor. d'Amico, Arnaldo. editor. Di Natale, Corrado. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-1324-6
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24. 
Cover image for Introductory MEMS Fabrication and Applications
Introductory MEMS Fabrication and Applications
Author 
Adams, Thomas M. author. Layton, Richard A. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-09511-0
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