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13. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
Format: 
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14. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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15. 
Cover image for Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Author 
Suhir, Ephraim. Lee, Y. C. Wong, C. P.
Preferred Shelf Number 
TK7874 .M438 2007 V.1
Format: 
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Beytepe Library~2
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16. 
Cover image for Contamination of electronic assemblies
Contamination of electronic assemblies
Author 
Pecht, Michael.
Preferred Shelf Number 
TK7870.15 C66 2003
Format: 
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17. 
Cover image for PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.
PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.
Author 
JAMNIA, ALI.
Preferred Shelf Number 
TK7870.15
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003564485
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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18. 
Cover image for Functional polyimide dielectrics : structure, properties, and applications
Functional polyimide dielectrics : structure, properties, and applications
Author 
Zha, Jun-Wei, editor.
Preferred Shelf Number 
TK7872 .D53 F86 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527849031
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19. 
Cover image for Recent Trends in VLSI and Semiconductor Packaging
Recent Trends in VLSI and Semiconductor Packaging
Author 
Vasudeva Reddy, T., editor. Madhava Rao, K., editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003616399
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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20. 
Cover image for Planar microwave sensors
Planar microwave sensors
Author 
Martín, Ferran, 1965- author. Vélez, Paris, author. Muñoz-Enano, Jonathan, author. Su, Lijuan, author.
Preferred Shelf Number 
TK7876 .M22 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119811060
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21. 
Cover image for Sensing technologies for real time monitoring of water quality
Sensing technologies for real time monitoring of water quality
Author 
Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.
Preferred Shelf Number 
TD367 .M3175 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843
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22. 
Cover image for Inkjet printing in industry : materials, technologies, systems, and applications
Inkjet printing in industry : materials, technologies, systems, and applications
Author 
Zapka, Werner, editor.
Preferred Shelf Number 
Z252.5 .I48 I55 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527828074
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23. 
Cover image for Lead-free soldering process development and reliability
Lead-free soldering process development and reliability
Author 
Bath, Jasbir, editor.
Preferred Shelf Number 
TK7870.15 .L434 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093
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24. 
Cover image for Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
Author 
Domingo, George, 1937- author.
Preferred Shelf Number 
TK7871.85 .D66 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119597124
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