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1. 
Cover image for Microelectronic applications of chemical mechanical planarization
Microelectronic applications of chemical mechanical planarization
Author 
Li, Yuzhuo. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0742/2007015557-b.html
John Wiley http://dx.doi.org/10.1002/9780470180907
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2. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
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3. 
Cover image for Chemical mechanical planarization of microelectronic materials
Chemical mechanical planarization of microelectronic materials
Author 
Steigerwald, Joseph M. Murarka, S. P. Gutmann, Ronald J. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527617746
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley041/96006198.html
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4. 
Cover image for Electron-beam technology in microelectronic fabrication
Electron-beam technology in microelectronic fabrication
Author 
Brewer, George Raymond, 1922- Ballantyne, J. P.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780121335502
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5. 
Cover image for Carbon-based nanocomposite applications and microelectronic technologies
Carbon-based nanocomposite applications and microelectronic technologies
Author 
Madkour, Loutfy H. (Loutfy Hamid), author.
Preferred Shelf Number 
TA418.9 .N35
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781032636092
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
Cover image for Microelectronic Circuit Design for Energy Harvesting Systems
Microelectronic Circuit Design for Energy Harvesting Systems
Author 
Di Paolo Emilio, Maurizio. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-47587-5
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7. 
Cover image for Plasma electronics : applications in microelectronic device fabrication
Plasma electronics : applications in microelectronic device fabrication
Author 
Makabe, T. (Toshiaki), author. Petrovic, Z., author.
Preferred Shelf Number 
TA2020 .M35 2015
Electronic Access 
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8. 
Cover image for Plasma electronics : applications in microelectronic device fabrication
Plasma electronics : applications in microelectronic device fabrication
Author 
Makabe, T. (Toshiaki), author. Petrovic, Z.
Preferred Shelf Number 
TA2020 .M35 2006
Electronic Access 
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9. 
Cover image for Modeling of film deposition for microelectronic applications
Modeling of film deposition for microelectronic applications
Author 
Rossnagel, Stephen M.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780125330220
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10. 
Cover image for Cryogenic Microelectronic Systems for Ultra-Low Energy and Enhanced Performance
Cryogenic Microelectronic Systems for Ultra-Low Energy and Enhanced Performance
Author 
Zhuldassov, Nurzhan. author. Friedman, Eby G. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-90754-8
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11. 
Cover image for Silicon, from sand to chips. 1, Microelectronic components
Silicon, from sand to chips. 1, Microelectronic components
Author 
Vignes, Alain, author.
Preferred Shelf Number 
TK7871.15 .S55 V54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394297610
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12. 
Cover image for Silicon, from sand to chips. 2, Microelectronic chips, solar cells, MEMS
Silicon, from sand to chips. 2, Microelectronic chips, solar cells, MEMS
Author 
Vignes, Alain, author.
Preferred Shelf Number 
TK7871.15 .S55 V54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394297641
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