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1. 
Cover image for EM Material Characterization Techniques for Metamaterials
EM Material Characterization Techniques for Metamaterials
Author 
Nair, Raveendranath U. author. Dutta, Maumita. author. P.S., Mohammed Yazeen. author. Venu, K. S. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-6517-0
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Cover image for Nanostructured Nonlinear Optical Materials : Formation and Characterization
Nanostructured Nonlinear Optical Materials : Formation and Characterization
Author 
Ganeev, Rashid A., author.
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ScienceDirect https://www.sciencedirect.com/science/book/9780128143032
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3. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09111-2
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4. 
Cover image for Power Electronics Converters and Regulators
Power Electronics Converters and Regulators
Author 
Dokić, Branko L. author. Blanuša, Branko. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09402-1
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5. 
Cover image for Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2751-7
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6. 
Cover image for Lasers with Nuclear Pumping
Lasers with Nuclear Pumping
Author 
Melnikov, S.P. author. Sinyanskii, A.A. author. Sizov, A.N. author. Miley, George H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08882-2
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7. 
Cover image for Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Author 
Kaltenbacher, Manfred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-40170-1
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8. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9266-5
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9. 
Cover image for Carbon Nanotube Based VLSI Interconnects Analysis and Design
Carbon Nanotube Based VLSI Interconnects Analysis and Design
Author 
Kaushik, Brajesh Kumar. author. Majumder, Manoj Kumar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-2047-3
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10. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12862-7
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11. 
Cover image for Thermal Management for LED Applications
Thermal Management for LED Applications
Author 
Lasance, Clemens J.M. editor. Poppe, András. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-5091-7
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12. 
Cover image for Copper Wire Bonding
Copper Wire Bonding
Author 
Chauhan, Preeti S. author. Choubey, Anupam. author. Zhong, ZhaoWei. author. Pecht, Michael G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-5761-9
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