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25. 
Cover image for Proceedings of the 2023 International Conference on Wireless Communications, Networking and Applications
Proceedings of the 2023 International Conference on Wireless Communications, Networking and Applications
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Siarry, Patrick. editor. (orcid)0000-0002-5722-4115 Jabbar, M. A. editor. Cheung, Simon King Sing. editor. (orcid)0000-0002-7323-0961 Li, Xiaolong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-2409-6
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26. 
Cover image for SOC-Based Solutions in Emerging Application Domains
SOC-Based Solutions in Emerging Application Domains
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Chakravarthi, Veena S. author. (orcid)0000-0002-8703-2376 Koteshwar, Shivananda R. author. (orcid)0000-0003-4299-4069 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-85044-8
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27. 
Cover image for Fully-Integrated Low-Dropout Regulators
Fully-Integrated Low-Dropout Regulators
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Mao, Xiangyu. author. (orcid)0000-0001-6530-8311 Lu, Yan. author. Martins, Rui P. author. SpringerLink (Online service)
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28. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VIII
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VIII
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Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4787-3
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29. 
Cover image for Revealing Hybrid DC-DC Converters
Revealing Hybrid DC-DC Converters
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Huang, Mo. author. (orcid)0000-0003-0497-194X Martins, Rui Paulo. author. SpringerLink (Online service)
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30. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume IX
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume IX
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Yang, Qingxin. editor. Zhu, Chunbo. editor. Xia, Chenyang. editor. Li, Yang. editor. Luo, Zhichao. editor.
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31. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
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Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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32. 
Cover image for Micro- and Nano-Systems in 21st-Century Designs, Developments, Applications and Perspective
Micro- and Nano-Systems in 21st-Century Designs, Developments, Applications and Perspective
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Pachkawade, Vinayak. editor. Guha, Koushik. editor. SpringerLink (Online service)
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33. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2024
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2024
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Guha, Koushik. editor. Saha, Samar Kanti. editor. (orcid)0000-0002-5687-591X Iannacci, Jacopo. editor. (orcid)0000-0001-6462-4814 SpringerLink (Online service)
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34. 
Cover image for Principles of Electrical Measurement and Measuring Instruments
Principles of Electrical Measurement and Measuring Instruments
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Jagadeesh Kumar, V. author. (orcid)0000-0002-2575-5632 SpringerLink (Online service)
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35. 
Cover image for Principles of electrochemical conversion and storage devices
Principles of electrochemical conversion and storage devices
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Huang, Kevin, author.
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QD553 .H83 2025
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36. 
Cover image for Composites-based perovskite solar cells
Composites-based perovskite solar cells
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Hahn, Yoon-Bong, author Wang, Yousheng, author Mahmoudi, Tahmineh, author
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TK2963 .P47
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