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25. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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26. 
Cover image for CMOS-based Portable NMR/MRI Microsystems
CMOS-based Portable NMR/MRI Microsystems
Author 
Fan, Shuhao. author. Zhou, Qi. author. (orcid)0000-0002-3949-7953 Lei, Ka-Meng. author. Martins, Rui P. author. Mak, Pui-In. author.
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https://doi.org/10.1007/978-3-031-91447-8
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27. 
Cover image for Micro- and Nano-Systems in 21st-Century Designs, Developments, Applications and Perspective
Micro- and Nano-Systems in 21st-Century Designs, Developments, Applications and Perspective
Author 
Pachkawade, Vinayak. editor. Guha, Koushik. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4659-3
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28. 
Cover image for Principles of Electrical Measurement and Measuring Instruments
Principles of Electrical Measurement and Measuring Instruments
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Jagadeesh Kumar, V. author. (orcid)0000-0002-2575-5632 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-5475-8
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29. 
Cover image for Analog Microelectronics
Analog Microelectronics
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Borgarino, Mattia. author. (orcid)0000-0001-9678-592X SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-94286-0
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30. 
Cover image for Signal Processing, Telecommunication and Embedded Systems: Automation and Sustainability Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 4
Signal Processing, Telecommunication and Embedded Systems: Automation and Sustainability Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 4
Author 
Bhateja, Vikrant. editor. Flores-Fuentes, Wendy. editor. (orcid)0000-0002-1477-7449 Bhattacharya, Anagha. editor. Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-7253-0
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31. 
Cover image for A Problem-Solving Approach to Electric Circuits Volume I
A Problem-Solving Approach to Electric Circuits Volume I
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Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-95623-2
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32. 
Cover image for Principles of electrochemical conversion and storage devices
Principles of electrochemical conversion and storage devices
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Huang, Kevin, author.
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QD553 .H83 2025
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https://onlinelibrary.wiley.com/doi/book/10.1002/9783527851638
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33. 
Cover image for Single element semiconductors : properties and devices
Single element semiconductors : properties and devices
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Shi, Yi (Electrical engineer), author. Yan, Shancheng, author.
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TK7871.85 .S55 2025
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https://onlinelibrary.wiley.com/doi/book/10.1002/9783527851782
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34. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume V
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume V
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Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-8824-8
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35. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VI
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VI
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Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-8828-6
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36. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume V
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume V
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Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-1391-5
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